X-On Electronics has gained recognition as a prominent supplier of IS61NLP12836B-200B2LI SRAM across the USA, India, Europe, Australia, and various other global locations. IS61NLP12836B-200B2LI SRAM are a product manufactured by ISSI. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

IS61NLP12836B-200B2LI ISSI

IS61NLP12836B-200B2LI electronic component of ISSI
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Part No.IS61NLP12836B-200B2LI
Manufacturer: ISSI
Category: SRAM
Description: SRAM Chip Sync Quad 3.3V 4M-bit 128K x 36 3.1ns 119-Pin BGA
Datasheet: IS61NLP12836B-200B2LI Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
240: USD 3.6747 ea
Line Total: USD 881.93 
Availability - 0
MOQ: 240  Multiples: 240
Pack Size: 240
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0
Ship by Wed. 04 Dec to Tue. 10 Dec
MOQ : 240
Multiples : 240
240 : USD 3.6747

   
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We are delighted to provide the IS61NLP12836B-200B2LI from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IS61NLP12836B-200B2LI and other electronic components in the SRAM category and beyond.

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IS61NLP12832B IS61NLP12836B/IS61NVP12836B IS61NLP25618A/IS61NVP25618A 128K x 32, 128K x 36, and 256K x 18 4Mb, PIPELINE NO WAIT STATE BUS SRAM SEPTEMBER 2007 FEATURES DESCRIPTION The 4 Meg NLP/NVP product family feature high-speed, 100 percent bus utilization low-power synchronous static RAMs designed to provide No wait cycles between Read and Wr ite a burstable, high-perfor mance, no wait state, device for Inter nal self-timed wr ite cycle networ king and communications applications. They are organized as 128K words by 32 bits, 128K words by 36 Individual Byte Wr ite Control bits, and 256K words by 18 bits, fabr icated with ISSI s Single R/W (Read/Wr ite) control pin advanced CMOS technology. Clock controlled, registered address, Incor porating a no wait state feature, wait cycles are data and control eliminated when the bus switches from read to write, or wr ite to read. This device integrates a 2-bit burst counter, Inter leaved or linear burst sequence control us- high-speed SRAM core, and high-dr ive capability outputs ing MODE input into a single monolithic circuit. Three chip enables for simple depth expansion All synchronous inputs pass through registers are controlled and address pipelining by a positive-edge-tr iggered single clock input. Operations may be suspended and all synchronous inputs ignored Power Down mode when Clock Enable, CKE is HIGH. In this state the inter nal Common data inputs and data outputs device will hold their previous values. CKE pin to enable clock and suspend operation All Read, Wr ite and Deselect cycles are initiated by the ADV JEDEC 100-pin TQFP, 165-ball PBGA and 119- input. When the ADV is HIGH the inter nal burst counter is incremented. New exter nal addresses can be loaded ball PBGA packages when ADV is LOW. Power supply: Wr ite cycles are inter nally self-timed and are initiated NVP: Vdd 2.5V ( 5%), Vdqd 2.5V ( 5%) by the rising edge of the clock inputs and when WE is NLP: Vdd 3.3V ( 5%), Vqdd 3.3V/2.5V ( 5%) LOW. Separate byte enables allow individual bytes to be Industr ial temperature available written. Lead-free available A burst mode pin (MODE) defines the order of the burst sequence. When tied HIGH, the inter leaved burst sequence is selected. When tied LOW, the linear burst sequence is selected. FAST ACCESS TIME Symbol Parameter -250 -200 Units tkq Clock Access Time 2.6 3.1 ns tck Cycle Time 4 5 ns Frequency 250 200 MHz Copyright 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. www.issi.com 1 Rev. D 09/10/07IS61NLP12832B IS61NLP12836B/IS61NVP12836B IS61NLP25618A/IS61NVP25618A BLOCK DIAGRAM 128Kx32 A2-A16 or A2-A17 x 32/x 36: A 0:16 or ADDRESS 128Kx36 x 18: A 0:17 REGISTER 256Kx18 MEMORY ARRAY MODE BURST ADDRESS K DATA-IN A0-A1 A 0-A 1 COUNTER REGISTER K DATA-IN WRITE WRITE CLK CONTROL REGISTER ADDRESS ADDRESS LOGIC K CKE REGISTER REGISTER CE CE2 CE2 CONTROL ADV K REGISTER CONTROL OUTPUT WE LOGIC REGISTER BWX (X=a,b,c,d or a,b) BUFFER OE ZZ 32, 36 or 18 DQx/DQPx 2 Integrated Silicon Solution, Inc. www.issi.com Rev. D 09/10/07

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
Integrated Silicon Solution ()
Integrated Silicon Solution (ISSI)
INTEGRATED SILICON SOLUTIONS INC
ISSI
ISSI(Integrated Silicon Solution)
ISSI, Integrated Silicon Solution Inc
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