IS61WV51232ALL/ALS IS61WV51232BLL/BLS IS64WV51232BLL/BLS 512K x 32 HIGH-SPEED ASYNCHRONOUS JUNE 2016 CMOS STATIC RAM WITH 3.3V SUPPLY FEATURES DESCRIPTION High-speed access times: The ISSI IS61WV51232Axx/Bxx and IS64WV51232Bxx are high-speed, 16M-bit static RAMs organized as 512K words 8, 10, 20 ns by 32 bits. It is fabricated using ISSI s high-performance High-perfor mance, low-power CMOS process CMOS technology. This highly reliable process coupled Multiple center power and ground pins for greater with innovative circuit design techniques, yields high- noise immunity performance and low power consumption devices. Easy memor y expansion with CE and OE options CE power-down When CE is HIGH (deselected), the device assumes a Fully static operation: no clock or refresh standby mode at which the power dissipation can be re- required duced down with CMOS input levels. TTL compatible inputs and outputs Single power supply Easy memor y expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW Vdd 1.65V to 2.2V (IS61WV51232Axx) Wr ite Enable (WE) controls both writing and reading of speed = 20ns for Vdd 1.65V to 2.2V the memory. Vdd 2.4V to 3.6V (IS61/64WV51232Bxx) speed = 10ns for Vdd 2.4V to 3.6V The device is packaged in the JEDEC standard 90-ball speed = 8ns for Vdd 3.3V + 5% BGA (8mm x 13mm). Packages available: 90-ball miniBGA (8mm x 13mm) Industr ial and Automotive Temperature Suppor t Lead-free available FUNCTIONAL BLOCK DIAGRAM 512K x 32 A0-A18 DECODER MEMORY ARRAY VDD VSS DQa-d I/O COLUMN I/O DATA CIRCUIT CE OE CONTROL WE CIRCUIT BWa-d CE2 Copyright 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason- ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized b.) the user assume all such risks and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. www.issi.com 1 Rev. A 06/01/2016IS61WV51232ALL/ALS IS61WV51232BLL/BLS IS64WV51232BLL/BLS PIN CONFIGURATION PACKAGE CODE: B 90 BALL FBGA (Top View) (8.00 mm x 13.00 mm Body, 0.8 mm Ball Pitch) 1 2 3 4 5 6 7 8 9 A DQ1 DQ0 VSS VDD DQ31 DQ30 B DQ2 VDD VSS VDD VSS DQ29 C VSS DQ3 DQ4 DQ27 DQ28 VDD D VSS DQ6 DQ5 DQ26 DQ25 VDD E VDD DQ7 NC NC DQ24 VSS F VSS BWa A3 A4 BWd VDD G A0 A1 A2 A10 A5 A6 H A15 A14 A13 A8 A7 A11 J CE2 A17 A16 A9 A12 CE K BWb NC A18 WE OE BWc L VDD DQ8 VSS DQ23 VDD VSS M VSS DQ9 DQ10 DQ22 DQ21 VDD N VSS DQ12 DQ11 DQ19 DQ20 VDD P DQ13 VDD VSS VSS VDD DQ18 R DQ14 DQ15 VSS DQ16 VDD DQ17 PIN DESCRIPTIONS A0-A18 Address Inputs DQx Data I/O CE, CE2 Chip Enable Input OE Output Enable Input WE Wr ite Enable Input BWx (x=a-d) Byte Write Control Vdd Power Vss Ground NC No Connection 2 Integrated Silicon Solution, Inc. www.issi.com Rev. A 06/01/2016