IS62C51216AL IS65C51216AL 512Kx16LOW VOLTAGE, ULTRALOWPO WERCMOSST ATICRAM DECEMBER2010 FEATURES DESCRIPTION The ISSI IS62C51216AL and IS65C51216AL are high- High-speed access time: 45ns, 55ns speed, 8M bit static RAMs organized as 512K words by 16 CMOS low power operation bits. It is fabricated using ISSI s high-performance CMOS technology. This highly reliable process coupled with 36 mW (typical) operating innovative circuit design techniques, yields high-performance 12 W (typical) CMOS standby and low power consumption devices. TTL compatible interface levels When CS1 is HIGH (deselected) or when CS2 is LOW (deselected) or when CS1 is LOW, CS2 is HIGH and both Single power supply LB and UB are HIGH, the device assumes a standby mode at which the power dissipation can be reduced down with 4.5V--5.5V Vdd CMOS input levels. Fully static operation: no clock or refresh Easy memory expansion is provided by using Chip Enable required and Output Enable inputs. The active LOW Write Enable (WE) Three state outputs controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access. Data control for upper and lower bytes The IS62C51216AL and IS65C51216AL are packaged in o o Automotive temperature (-40 C to +125 C) the JEDEC standard 48-pin mini BGA (9mm x 11mm) and 44-Pin TSOP (TYPE II). Lead-free available FUNCTIONALBLOCKDIAGRAM 512K x 16 A0-A18 DECODER MEMORY ARRAY VDD GND I/O0-I/O7 I/O Lower Byte COLUMN I/O DATA CIRCUIT I/O8-I/O15 Upper Byte CS2 CS1 OE CONTROL CIRCUIT WE UB LB Copyright 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized b.) the user assume all such risks and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. www.issi.com 1-800-379-4774 1 Rev. B 11/23/2010IS62C51216AL, IS65C51216AL PINCONFIGURA TIONS PINDESCRIPTIONS A0-A18 Address Inputs 48-Pinmini BGA (9mmx11mm) I/O0-I/O15 Data Inputs/Outputs 1 2 3 4 5 6 CS1, CS2 Chip Enable Input OE Output Enable Input WE Write Enable Input LB Lower-byte Control (I/O0-I/O7) UB Upper-byte Control (I/O8-I/O15) LB A0 A1 A2 A OE CS2 NC No Connection A4 I/O UB A3 CS1 I/O B 8 0 Vdd Power I/O I/O A5 A6 I/O I/O C 9 10 1 2 GND Ground GND A17 A7 I/O I/O VDD D 11 3 I/O GND VDD I/O NC A16 4 E 12 I/O I/O A14 A15 I/O I/O F 14 13 5 6 I/O NC A12 WE 15 A13 I/O G 7 A18 A8 A9 A10 A11 NC H 44-Pin TSOP(T ypeII) 44 A4 1 A5 A3 2 43 A6 A2 3 42 A7 A1 4 41 OE A0 5 40 UB CS1 6 39 LB I/O0 7 38 I/O15 I/O1 8 37 I/O14 I/O2 9 36 I/O13 I/O3 10 35 I/O12 VDD 11 34 GND GND 12 33 VDD I/O4 13 32 I/O11 I/O5 14 31 I/O10 I/O6 15 30 I/O9 I/O7 16 29 I/O8 WE 17 28 A18 A16 18 27 A8 A15 19 26 A9 A14 20 25 A10 A13 21 24 A11 A12 22 23 A17 2 Integrated Silicon Solution, Inc. www.issi.com 1-800-379-4774 Rev. B 11/23/2010