X-On Electronics has gained recognition as a prominent supplier of IXTN210P10T Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. IXTN210P10T Discrete Semiconductor Modules are a product manufactured by IXYS. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

IXTN210P10T IXYS

IXTN210P10T electronic component of IXYS
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See Product Specifications
Part No.IXTN210P10T
Manufacturer: IXYS
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules TrenchP Channel Power MOSFETs
Datasheet: IXTN210P10T Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 51.2177 ea
Line Total: USD 51.22 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 49.4251
10 : USD 46.106
30 : USD 44.1707
100 : USD 40.0294
500 : USD 37.7631
1000 : USD 36.4696

0
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 51.2177

   
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We are delighted to provide the IXTN210P10T from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IXTN210P10T and other electronic components in the Discrete Semiconductor Modules category and beyond.

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Preliminary Technical Information TM TrenchP V = -100V IXTN210P10T DSS Power MOSFET I = - 210A D25 R 7.5m DS(on) D t 200ns rr P-Channel Enhancement Mode G Avalanche Rated S Fast Intrinsic Rectifier miniBLOC S E153432 S G Symbol Test Conditions Maximum Ratings S V T = 25C to 150C -100 V DSS J D V T = 25C to 150C, R = 1M -100 V DGR J GS V Continuous 15 V GSS G = Gate D = Drain S = Source V Transient 25 V GSM I T = 25C (Chip Capability) - 210 A Either Source Terminal S can be used as D25 C the Source Terminal or the Kelvin Source I Lead Current Limit, RMS - 200 A LRMS (Gate Return) Terminal. I T = 25C, Pulse Width Limited by T - 800 A DM C JM I T = 25C -100 A A C E T = 25C3J AS C Features dv/dt I I , V V , T 150C 10 V/ns S DM DD DSS J z International Standard Package P T = 25C 830 W z D C Low Intrinsic Gate Resistance z miniBLOC with Aluminum Nitride T - 55 ... +150 C J Isolation T 150 C JM z Avalanche Rated T - 55 ... +150 C stg z Extended FBSOA z V 50/60 Hz, RMS, t = 1minute 2500 V~ Fast Intrinsic Recitifier ISOL z I 1mA, t = 1s 3000 V~ Low R and Q ISOL DS(ON) G M Mounting Torque for Base Plate 1.5/13 Nm/lb.in. d Terminal Connection Torque 1.3/11.5 Nm/lb.in. Advantages Weight 30 g z Easy to Mount z Space Savings z High Power Density Symbol Test Conditions Characteristic Values (T = 25C, Unless Otherwise Specified) Min. Typ. Max. J Applications BV V = 0V, I = - 250A -100 V DSS GS D z High-Side Switching V V = V , I = - 250A - 2.5 - 4.5 V GS(th) DS GS D z Push Pull Amplifiers z DC Choppers I V = 15V, V = 0V 200 nA GSS GS DS z Automatic Test Equipment I V = V , V = 0V - 25 A z DSS DS DSS GS Current Regulators T = 125C - 300 A z J Battery Charger Applications R V = -10V, I = 0.5 I , Note 1 7.5 m DS(on) GS D D25 2011 IXYS CORPORATION, All Rights Reserved DS100408A(01/13)IXTN210P10T Symbol Test Conditions Characteristic Values SOT-227B (IXTN) Outline (T = 25C, Unless Otherwise Specified) Min. Typ. Max. J g V = -10V, I = - 60A, Note 1 90 150 S fs DS D C 69.5 nF iss C V = 0V, V = - 25V, f = 1MHz 4070 pF oss GS DS C 1100 pF rss t 90 ns d(on) Resistive Switching Times t 98 ns r V = -10V, V = 0.5 V , I = 0.5 I GS DS DSS D D25 t 165 ns d(off) R = 1 (External) G t 55 ns f (M4 screws (4x) supplied) Q 740 nC g(on) Q V = -10V, V = 0.5 V , I = 0.5 I 200 nC gs GS DS DSS D D25 Q 155 nC gd R 0.15 C/W thJC R 0.05 C/W thCS Source-Drain Diode Symbol Test Conditions Characteristic Values (T = 25C, Unless Otherwise Specified) Min. Typ. Max. J I V = 0V - 210 A S GS I Repetitive, Pulse Width Limited by T - 840 A SM JM V I = -100A, V = 0V, Note 1 -1.4 V SD F GS t 200 ns rr I = -105A, -di/dt = -100A/s F Q 930 nC RM V = -100V, V = 0V R GS I -12.4 A RM Note 1. Pulse test, t 300s, duty cycle, d 2%. PRELIMINARY TECHNICAL INFORMATION The product presented herein is under development. The Technical Specifications offered are derived from data gathered during objective characterizations of preliminary engineering lots but also may yet contain some information supplied during a pre-production design evaluation. IXYS reserves the right to change limits, test conditions, and dimensions without notice. IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2 by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2 4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
IXS
IXYS
IXYS CORP
Ixys Corporation
IXYS INTEG.CIRCUITS DIV(CLARE)
IXYS Integrated Circuits
IXYS Integrated Circuits / Clare
IXYS Integrated Circuits Division
IXYS Integrated Circuits/Clare
IXYS RF
IXYS SEMICONDUCTOR
Littelfuse/IXYS
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