X-On Electronics has gained recognition as a prominent supplier of APT80GA60LD40 IGBT Transistors across the USA, India, Europe, Australia, and various other global locations. APT80GA60LD40 IGBT Transistors are a product manufactured by Microchip. We provide cost-effective solutions for IGBT Transistors, ensuring timely deliveries around the world.

APT80GA60LD40 Microchip

APT80GA60LD40 electronic component of Microchip
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See Product Specifications
Part No.APT80GA60LD40
Manufacturer: Microchip
Category: IGBT Transistors
Description: IGBT Transistors Insulated Gate Bipolar Transistor - PT Power MOS 8 - Combi
Datasheet: APT80GA60LD40 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 13.846 ea
Line Total: USD 13.85

Availability - 32
Ship by Mon. 29 Jul to Wed. 31 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
32
Ship by Mon. 29 Jul to Wed. 31 Jul
MOQ : 1
Multiples : 1
1 : USD 13.846
500 : USD 12.5925
1000 : USD 12.3855
5000 : USD 12.098

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Maximum Gate Emitter Voltage
Continuous Collector Current at 25 C
Gate-Emitter Leakage Current
Package / Case
Packaging
Technology
Mounting Style
Technology
Pd - Power Dissipation
Minimum Operating Temperature
Maximum Operating Temperature
Continuous Collector Current Ic Max
Height
Length
Operating Temperature Range
Width
Brand
Continuous Collector Current
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
Taric
Tradename
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the APT80GA60LD40 from our IGBT Transistors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the APT80GA60LD40 and other electronic components in the IGBT Transistors category and beyond.

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APT80GA60LD40 600V High Speed PT IGBT POWER MOS 8 is a high speed Punch-Through switch-mode IGBT. Low E is achieved off through leading technology silicon design and lifetime control processes. A reduced E - off V tradeoff results in superior ef ciency compared to other IGBT technologies. Low CE(ON) gate charge and a greatly reduced ratio of C /C provide excellent noise immunity, short res ies delay times and simple gate drive. The intrinsic chip gate resistance and capacitance of the APT80GA60LD40 poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even when switching at high frequency. Combi (IGBT and Diode) FEATURES TYPICAL APPLICATIONS Fast switching with low EMI ZVS phase shifted and other full bridge Very Low E for maximum ef ciency Half bridge off Ultra low C for improved noise immunity High power PFC boost res Low conduction loss Welding Low gate charge UPS, solar, and other inverters Increased intrinsic gate resistance for low EMI High frequency, high ef ciency industrial RoHS compliant Absolute Maximum Ratings Symbol Parameter Ratings Unit Collector Emitter Voltage 600 V V ces I Continuous Collector Current T = 25C 143 C1 C A I Continuous Collector Current T = 100C 80 C2 C 1 I Pulsed Collector Current 240 CM 2 V Gate-Emitter Voltage 30 V GE P Total Power Dissipation T = 25C 625 W D C SSOA Switching Safe Operating Area T = 150C 240A 600V J T , T Operating and Storage Junction Temperature Range -55 to 150 J STG C T Lead Temperature for Soldering: 0.063 from Case for 10 Seconds 300 L Static Characteristics T = 25C unless otherwise speci ed J Symbol Parameter Test Conditions Min Typ Max Unit V Collector-Emitter Breakdown Voltage V = 0V, I = 1.0mA 600 BR(CES) GE C T = 25C 2.0 2.5 V = 15V, GE J V V Collector-Emitter On Voltage CE(on) I = 47A T = 125C 1.9 C J V Gate Emitter Threshold Voltage V =V , I = 1mA 3 4.5 6 GE(th) GE CE C V = 600V, T = 25C 275 J CE I Zero Gate Voltage Collector Current A CES V = 0V T = 125C 3000 GE J I Gate-Emitter Leakage Current V = 30V 100 nA GES GS Microsemi Website - APT80GA60LD40 Dynamic Characteristics T = 25C unless otherwise speci ed J Symbol Parameter Test Conditions Min Typ Max Unit C Input Capacitance Capacitance 6390 ies C Output Capacitance 580 V = 0V, V = 25V pF oes GE CE C Reverse Transfer Capacitance 63 f = 1MHz res 3 Q Total Gate Charge Gate Charge 230 g Q Gate-Emitter Charge V = 15V 40 ge GE nC V = 300V CE Q Gate- Collector Charge 78 gc I = 47A C 4 T = 150C, R = 4.7 , V = 15V, J G GE SSOA Switching Safe Operating Area 240 A L= 100uH, V = 600V CE t Turn-On Delay Time Inductive Switching (25C) 23 d(on) t Current Rise Time V = 400V 27 r CC ns t Turn-Off Delay Time V = 15V 158 d(off) GE t Current Fall Time I = 47A 78 f C 4 E Turn-On Switching Energy 840 R = 4.7 on2 G J 6 751 E Turn-Off Switching Energy T = +25C off J t Turn-On Delay Time Inductive Switching (125C) 21 d(on) t Current Rise Time V = 400V 31 r CC ns t Turn-Off Delay Time V = 15V 194 d(off) GE t Current Fall Time 132 I = 47A f C 4 E Turn-On Switching Energy 1275 R = 4.7 on2 G J 6 E Turn-Off Switching Energy 1112 T = +125C off J Thermal and Mechanical Characteristics Symbol Characteristic Min Typ Max Unit R Junction to Case Thermal Resistance (IGBT) - - 0.2 JC C/W R Junction to Case Thermal Resistance (Diode) .67 JC W Package Weight - 6.1 - g T Torque Mounting Torque (TO-264 Package), 4-40 or M3 screw 10 inlbf 1 Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature. 2 Pulse test: Pulse Width < 380 s, duty cycle < 2%. 3 See Mil-Std-750 Method 3471. 4 R is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452) G 5 E is the clamped inductive turn on energy that includes a commutating diode reverse recovery current in the IGBT turn on energy loss. A combi device is used for the on2 clamping diode. 6 E is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. off Microsemi reserves the right to change, without notice, the speci cations and information contained herein. 052-6342 Rev D 6 - 2011

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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