X-On Electronics has gained recognition as a prominent supplier of ATSAMA5D27C-D1G-CUR Microprocessors - MPU across the USA, India, Europe, Australia, and various other global locations. ATSAMA5D27C-D1G-CUR Microprocessors - MPU are a product manufactured by Microchip. We provide cost-effective solutions for Microprocessors - MPU, ensuring timely deliveries around the world.

ATSAMA5D27C-D1G-CUR Microchip

ATSAMA5D27C-D1G-CUR electronic component of Microchip
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Part No.ATSAMA5D27C-D1G-CUR
Manufacturer: Microchip
Category: Microprocessors - MPU
Description: Microprocessors - MPU BGA GREEN, IND TEMP MRLC,1GBit DDR2,T&R
Datasheet: ATSAMA5D27C-D1G-CUR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 17.754 ea
Line Total: USD 17.75 
Availability - 2027
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
970
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 1
Multiples : 1
1 : USD 23.775
50 : USD 18.975
100 : USD 18.325
250 : USD 18.05
500 : USD 17.775
750 : USD 17.5125
1000 : USD 17.25

2027
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 17.754
25 : USD 17.116
100 : USD 16.533
500 : USD 16.137
1000 : USD 16.126

   
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We are delighted to provide the ATSAMA5D27C-D1G-CUR from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATSAMA5D27C-D1G-CUR and other electronic components in the Microprocessors - MPU category and beyond.

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SAMA5D2 SIP SAMA5D2 System in Package (SIP) MPU with up to 1 Gbit DDR2 SDRAM or 2 Gbit LPDDR2 SDRAM Scope This document is an overview of the main features of the SAMA5D2 SIP. The sole reference documents for product information on the SAMA5D2 and the LPDDR2/DDR2-SDRAM memories are listed in the table below. Introduction The SAMA5D2 System-In-Package (SIP) integrates the Arm Cortex -A5 processor-based SAMA5D2 MPU with up to 1 Gbit DDR2-SDRAM or up to 2 Gbit LPDDR2-SDRAM in a single package. By combining the high-performance, ultra-low power SAMA5D2 with LPDDR2/DDR2-SDRAM in a single package, PCB routing complexity, area and number of layers is reduced in the majority of cases. This makes board design easier and more robust by facilitating design for EMI, ESD and signal integrity. DDR2-SDRAM memory sizes and package options available 128 Mbit, TFBGA196 512 Mbit and 1 Gbit, TFBGA289 LPDDR2-SDRAM memory sizes and package options available 1 Gbit and 2 Gbit, TFBGA361 While the smallest option targets applications with a small OS or bare metal, the larger options are suitable for applications using Linux . Reference Documents Type Document Title Available Ref. No. Data sheet SAMA5D2 Series www.microchip.com DS60001476 2 Mwords 4 Banks 16 bits Data sheet www.winbond.com W9712G6KB25I DDR2 SDRAM (128 Mbit) 8 Mwords 4 Banks 16 bits Data sheet www.winbond.com W9751G6KB25I DDR2 SDRAM (512 Mbit) 8 Mwords 8 Banks 16 bits Data sheet www.winbond.com W971GG6SB25I DDR2 SDRAM (1 Gbit) 4 Mwords 8 Banks 32 bits Data sheet www.apmemory.com AD210032F-I-AB LPDDR2-SDRAM (1 Gbit) 8 Mwords 8 Banks 32 bits Data sheet www.apmemory.com AD220032D-I-ED/PC/AB LPDDR2-SDRAM (2 Gbit) Datasheet DS60001484D-page 1 2021 Microchip Technology Inc. SAMA5D2 SIP Table of Contents Scope............................................................................................................................................................. 1 Introduction.....................................................................................................................................................1 Reference Documents....................................................................................................................................1 1. Features..................................................................................................................................................4 2. DDR2-SDRAM Features......................................................................................................................... 7 3. LPDDR2-SDRAM Features.....................................................................................................................8 4. Configuration Summary.......................................................................................................................... 9 5. Chip Identifier........................................................................................................................................10 6. Package and Ballout..............................................................................................................................11 7. Memory................................................................................................................................................. 39 8. Electrical Characteristics.......................................................................................................................40 8.1. Recommended Thermal Operating Conditions..........................................................................40 8.2. Decoupling................................................................................................................................. 40 8.3. Power Sequences...................................................................................................................... 40 9. Mechanical Characteristics................................................................................................................... 45 9.1. 361-ball TFBGA..........................................................................................................................45 9.2. 289-ball TFBGA..........................................................................................................................48 9.3. 196-ball TFBGA..........................................................................................................................49 10. Ordering Information............................................................................................................................. 50 11. Revision History.................................................................................................................................... 51 11.1. DS60001484D - 03/2021............................................................................................................51 11.2. DS60001484C - 01/2020............................................................................................................51 11.3. DS60001484B - 11/2018............................................................................................................51 11.4. DS60001484A - 09/2017............................................................................................................51 The Microchip Website.................................................................................................................................52 Product Change Notification Service............................................................................................................52 Customer Support........................................................................................................................................ 52 Product Identification System.......................................................................................................................53 Microchip Devices Code Protection Feature................................................................................................53 Legal Notice................................................................................................................................................. 54 Trademarks.................................................................................................................................................. 54 Quality Management System....................................................................................................................... 55 DS60001484D-page 2 Datasheet 2021 Microchip Technology Inc.

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

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