X-On Electronics has gained recognition as a prominent supplier of ZL40250LDG1 Clock Buffer across the USA, India, Europe, Australia, and various other global locations. ZL40250LDG1 Clock Buffer are a product manufactured by Microchip. We provide cost-effective solutions for Clock Buffer, ensuring timely deliveries around the world.

ZL40250LDG1 Microchip

ZL40250LDG1 electronic component of Microchip
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Part No.ZL40250LDG1
Manufacturer: Microchip
Category: Clock Buffer
Description: Microsemi 6 Output I/O Divider & External EEPROM
Datasheet: ZL40250LDG1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
260: USD 8.3969 ea
Line Total: USD 2183.19 
Availability - 0
MOQ: 260  Multiples: 260
Pack Size: 260
Availability Price Quantity
0
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ : 260
Multiples : 260
260 : USD 8.3969
520 : USD 8.1196

   
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We are delighted to provide the ZL40250LDG1 from our Clock Buffer category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ZL40250LDG1 and other electronic components in the Clock Buffer category and beyond.

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Register Map: Section 5.2 TM ZL40250 ZL40253 SmartBuffer 6- or 10-Output Programmable Fanout Buffers with Multi-Format I/O and Dividers Data Sheet September 2020 Features Ordering Information Four Flexible Input Clocks ZL40250LDG1 ext. EEPROM 6 Outputs Trays ZL40250LDF1 ext. EEPROM 6 Outputs Tape and Reel One crystal/CMOS input ZL40251LDG1 int. EEPROM 6 Outputs Trays ZL40251LDF1 int. EEPROM 6 Outputs Tape and Reel Two differential/CMOS inputs ZL40252LDG1 ext. EEPROM 10 Outputs Trays ZL40252LDF1 ext. EEPROM 10 Outputs Tape and Reel One single-ended/CMOS input ZL40253LDG1 int. EEPROM 10 Outputs Trays ZL40253LDF1 int. EEPROM 10 Outputs Tape and Reel Any input frequency up to 1GHz (300MHz for Matte Tin CMOS) Package size: 8 x 8 mm, 56 Pin QFN -40 C to +85 C Manual clock switching by pin or register 6 or 10 Universal Output Clocks with Dividers General Features Each output has independent divider Automatic self-configuration at power-up from external (ZL40250 or 2) or internal (ZL40251 or 3) Low additive jitter <200fs RMS (12kHz-20MHz, EEPROM up to 8 configurations pin-selectable for input frequencies 100MHz) PCIe 1, 2, 3, 4 compliant Each output configurable as LVDS, LVPECL, HCSL, 2xCMOS or HSTL Four multi-purpose I/O pins 2 In 2xCMOS mode, the P and N pins can be SPI or I C processor Interface * different frequencies (e.g. 125MHz and 25MHz) Core supply voltage options: 2.5V only, 3.3V Multiple output supply voltage banks with only, 1.8V+2.5V or 1.8V+3.3V CMOS output voltages from 1.5V to 3.3V Space-saving 8x8mm QFN56 (0.5mm pitch) Precise output alignment circuitry from GPIO Easy-to-use evaluation/programming software * pin or register bit Applications * Per-output skew adjustment Clock signal fanout, format conversion, frequency Per-output enable/disable and glitchless division and skew adjustment in a wide variety of * start/stop (stop high or low) equipment types VDDOA OC1P, OC1N DIV1 DIV IC1P, IC1N Path 1 DIV IC2P, IC2N OC2P, OC2N DIV2 DIV IC3P VDDOB XA xtal Path 2 DIV OC3P, OC3N DIV3 driver XB VDDOC OC4P, OC4N DIV4 OC5P, OC5N DIV5 VDDOD 10-output OC6P, OC6N devices only DIV6 RSTN AC0/GPIO0 OC7P, OC7N DIV7 AC1/GPIO1 Microprocessor VDDOE AC2/GPIO2 Port OC8P, OC8N DIV8 TEST/GPIO3 (SPI or I2C Serial) VDDOF IF0/CSN OC9P, OC9N DIV9 and GPIO Pins IF1/MISO SCL/SCLK OC10P, OC10N DIV10 SDA/MOSI Figure 1 - Functional Block Diagram * some features require a higher-frequency input clock and enabling the output dividers 1 Microsemi Confidential Copyright 2020. Microsemi Corporation. All Rights Reserved. ZL40250-ZL40253 Data Sheet Table of Contents 1. APPLICATION EXAMPLES .......................................................................................................... 4 2. PIN DIAGRAM ............................................................................................................................... 4 3. PIN DESCRIPTIONS ..................................................................................................................... 5 4. FUNCTIONAL DESCRIPTION ...................................................................................................... 7 4.1 DEVICE IDENTIFICATION ................................................................................................................ 7 4.2 PIN-CONTROLLED AUTOMATIC CONFIGURATION AT RESET ............................................................. 7 4.2.1 ZL40250 and ZL40252 Internal ROM, External or No EEPROM ........................................................ 8 4.2.2 ZL40251 and ZL40253 Internal EEPROM .......................................................................................... 8 4.3 LOCAL OSCILLATOR OR CRYSTAL .................................................................................................. 9 4.3.1 External Oscillator .................................................................................................................................. 9 4.3.2 External Crystal and On-Chip Driver Circuit .......................................................................................... 9 4.3.3 Ring Oscillator (for Auto-Configuration) ............................................................................................... 10 4.4 INPUT SIGNAL FORMAT CONFIGURATION ...................................................................................... 10 4.5 PATH 1 AND PATH 2 SIGNAL SELECTION ...................................................................................... 10 4.6 OUTPUT CLOCK CONFIGURATION ................................................................................................ 10 4.6.1 Output Enable, Signal Format, Voltage and Interfacing ...................................................................... 11 4.6.2 Output Frequency Configuration .......................................................................................................... 11 4.6.3 Output Duty Cycle Adjustment ............................................................................................................. 12 4.6.4 Output Phase Adjustment .................................................................................................................... 12 4.6.5 Output-to-Output Phase Alignment ...................................................................................................... 12 4.6.6 Output Clock Start and Stop ................................................................................................................ 13 4.7 MICROPROCESSOR INTERFACE ................................................................................................... 14 4.7.1 SPI Slave ............................................................................................................................................. 14 4.7.2 SPI Master (ZL40250 and ZL40252 Only) ........................................................................................... 16 2 4.7.3 I C Slave .............................................................................................................................................. 17 4.8 INTERRUPT LOGIC ...................................................................................................................... 19 4.9 RESET LOGIC ............................................................................................................................. 20 4.10 POWER-SUPPLY CONSIDERATIONS .......................................................................................... 20 4.11 AUTO-CONFIGURATION FROM EEPROM OR ROM .................................................................... 20 4.11.1 Generating Device Configurations ....................................................................................................... 21 4.11.2 Direct EEPROM Write Mode (ZL40251 and ZL40253 Only) ............................................................... 21 4.11.3 Holding Other Devices in Reset During Auto-Configuration ................................................................ 21 4.12 CONFIGURATION SEQUENCE .................................................................................................... 21 4.13 POWER SUPPLY DECOUPLING AND LAYOUT RECOMMENDATIONS ............................................... 21 5. REGISTER DESCRIPTIONS ....................................................................................................... 21 5.1 REGISTER TYPES ....................................................................................................................... 21 5.1.1 Status Bits ............................................................................................................................................ 21 5.1.2 Configuration Fields ............................................................................................................................. 22 5.1.3 Bank-Switched Registers (ZL40251 and ZL40253 Only) .................................................................... 22 5.2 REGISTER MAP .......................................................................................................................... 23 5.3 REGISTER DEFINITIONS .............................................................................................................. 25 5.3.1 Global Configuration Registers ............................................................................................................ 25 5.3.2 Status Registers ................................................................................................................................... 32 5.3.3 Path 1 Configuration Registers ............................................................................................................ 38 5.3.4 Path 2 Configuration Registers ............................................................................................................ 39 5.3.5 Output Clock Configuration Registers .................................................................................................. 40 5.3.6 Input Clock Configuration Registers .................................................................................................... 45 6. ELECTRICAL CHARACTERISTICS ........................................................................................... 47 2 Microsemi Confidential

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