X-On Electronics has gained recognition as a prominent supplier of MT18HTF12872PZ-667G1 Memory Modules across the USA, India, Europe, Australia, and various other global locations. MT18HTF12872PZ-667G1 Memory Modules are a product manufactured by Micron. We provide cost-effective solutions for Memory Modules, ensuring timely deliveries around the world.

MT18HTF12872PZ-667G1 Micron

MT18HTF12872PZ-667G1 electronic component of Micron
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Part No.MT18HTF12872PZ-667G1
Manufacturer: Micron
Category: Memory Modules
Description: DRAM Module DDR2 SDRAM 1Gbyte 240RDIMM
Datasheet: MT18HTF12872PZ-667G1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
11: USD 24.6174 ea
Line Total: USD 270.79 
Availability - 0
MOQ: 11  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 11
Multiples : 1
11 : USD 24.6174
25 : USD 21.2716
100 : USD 12.1581
500 : USD 10.6358

   
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We are delighted to provide the MT18HTF12872PZ-667G1 from our Memory Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MT18HTF12872PZ-667G1 and other electronic components in the Memory Modules category and beyond.

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1GB, 2GB, 4GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM Features DDR2 SDRAM RDIMM MT18HTF12872PZ 1GB MT18HTF25672PZ 2GB MT18HTF51272PZ 4GB Figure 1: 240-Pin RDIMM (MO-237 R/C H) Features 240-pin, registered dual in-line memory module Module height: 30mm (1.181in) Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, or PC2-6400 1GB (128 Meg x 72), 2GB (256 Meg x 72), 4GB (512 Meg x72) Supports ECC error detection and correction V = V = +1.8V DD DDQ Options Marking V = 1.73.6V DDSPD Parity P JEDEC-standard 1.8V I/O (SSTL_18-compatible) Operating temperature Differential data strobe (DQS, DQS#) option None Commercial (0C T +85C) C 4n-bit prefetch architecture 1 I Industrial (40C T +85C) A Single rank Package Multiple internal device banks for concurrent 240-pin DIMM (halogen-free) Z 2 operation Frequency/CL 2.5ns @ CL = 5 (DDR2-800) -80E Programmable CAS# latency (CL) 2.5ns @ CL = 6 (DDR2-800) -800 Posted CAS# additive latency (AL) 3.0ns @ CL = 5 (DDR2-667) -667 t WRITE latency = READ latency - 1 CK 1. Contact Micron for industrial temperature Notes: Programmable burst lengths (BL): 4 or 8 module offerings. Adjustable data-output drive strength 2. CL = CAS (READ) latency; registered mode 64ms, 8192-cycle refresh will add one clock cycle to CL. On-die termination (ODT) Serial presence-detect (SPD) with EEPROM Gold edge contacts Halogen-free Table 1: Key Timing Parameters Data Rate (MT/s) t t t Speed Industry RCD RP RC Grade Nomenclature CL = 6 CL = 5 CL = 4 CL = 3 (ns) (ns) (ns) -80E PC2-6400 800 800 533 400 12.5 12.5 55 -800 PC2-6400 800 667 533 400 15 15 55 -667 PC2-5300 667 553 400 15 15 55 -53E PC2-4200 553 400 15 15 55 -40E PC2-3200 400 400 15 15 55 PDF: 09005aef83dadad1 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 htf18c128_256_512x72pz - Rev. C 1/11 EN 2010 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.1GB, 2GB, 4GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM Features Table 2: Addressing Parameter 1GB 2GB 4GB Refresh count 8K 8K 8K Row address 16K A[13:0] 16K A[13:0] 32K A[14:0] Device bank address 4 BA[1:0] 8 BA[2:0] 8 BA[2:0] Device configuration 512Mb (128 Meg x 4) 1Gb (256 Meg x 4) 2Gb (512 Meg x 4) Column address 2K A[11, 9:0] 2K A[11, 9:0] 2K A[11, 9:0] Module rank address 1 S0# 1 S0# 1 S0# Table 3: Part Numbers and Timing Parameters 1GB 1 Base device: MT47H128M4, 512Mb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT18HTF12872P(I)Z-80E__ 1GB 128 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF12872P(I)Z-800__ 1GB 128 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT18HTF12872P(I)Z-667__ 1GB 128 Meg x 72 5.3 GB/s 3.0ns/800 MT/s 5-5-5 Table 4: Part Numbers and Timing Parameters 2GB 1 Base device: MT47H256M4, 1Gb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT18HTF25672P(I)Z-80E__ 2GB 256 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF25672P(I)Z-800__ 2GB 256 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT18HTF25672P(I)Z-667__ 2GB 256 Meg x 72 5.3 GB/s 3.0ns/800 MT/s 5-5-5 Table 5: Part Numbers and Timing Parameters 4GB 1 Base device: MT47H512M4, 2Gb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT18HTF51272P(I)Z-80E__ 4GB 512 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT18HTF51272P(I)Z-800__ 4GB 512 Meg x 72 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT18HTF51272P(I)Z-667__ 4GB 512 Meg x 72 5.3 GB/s 3.0ns/800 MT/s 5-5-5 1. Data sheets for the base device can be found on Microns Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Con- sult factory for current revision codes. Example: MT18HTF25672PZ-667H1. PDF: 09005aef83dadad1 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 htf18c128_256_512x72pz - Rev. C 1/11 EN 2010 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

8542.32.00 33 No ..Memory cards (other than ""smart"" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)
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