256Mb: x4, x8, x16 Automotive SDRAM Features Automotive SDR SDRAM MT48LC64M4A2 16 Meg x 4 x 4 banks MT48LC32M8A2 8 Meg x 8 x 4 banks MT48LC16M16A2 4 Meg x 16 x 4 banks Options Marking Features 1 54-pin TSOP II OCPL (400 mil) P PC100- and PC133-compliant Pb-free Fully synchronous all signals registered on positive 60-ball FBGA (x4, x8) (8mm x 16mm) FB edge of system clock 60-ball FBGA (x4, x8) (8mm x 16mm) BB Internal, pipelined operation column address can Pb-free be changed every clock cycle 2 54-ball VFBGA (x16) (8mm x 14 mm) FG Internal banks for hiding row access/precharge 2 54-ball VFBGA (x16) (8mm x 14 mm) BG Programmable burst lengths: 1, 2, 4, 8, or full page Pb-free Auto precharge, includes concurrent auto precharge 3 54-ball VFBGA (x16) (8mm x 8 mm) F4 and auto refresh modes 3 54-ball VFBGA (x16) (8mm x 8 mm) B4 Self refresh mode (not available on AAT devices) Pb-free Auto refresh Timing cycle time 64ms, 8192-cycle (commercial and industrial) 6ns CL = 3 (x8, x16 only) -6A 16ms, 8192-cycle (automotive) 7.5ns CL = 3 (PC133) -75 LVTTL-compatible inputs and outputs 7.5ns CL = 2 (PC133) -7E Single 3.3V 0.3V power supply Self refresh AEC-Q100 Standard None PPAP submission 4 Low power L 8D response time Operating temperature range Industrial (40C to +85C) AIT Options Marking 4 Automotive (40C to +105C) AAT Configurations Revision :D/:G 64 Meg x 4 (16 Meg x 4 x 4 banks) 64M4 32 Meg x 8 (8 Meg x 8 x 4 banks) 32M8 1. Off-center parting line. Notes: 16 Meg x 16 (4 Meg x 16 x 4 banks) 16M16 2. Only available on Revision D. t Write recovery ( WR) 3. Only available on Revision G. t WR = 2 CLK A2 4. Contact Micron for availability. 1 Plastic package OCPL 1 54-pin TSOP II OCPL (400 mil) TG (standard) Table 1: Key Timing Parameters CL = CAS (READ) latency Access Time Clock Speed Grade Frequency CL = 2 CL = 3 Setup Time Hold Time -6A 167 MHz 5.4ns 1.5ns 0.8ns -7E 143 MHz 5.4ns 1.5ns 0.8ns -75 133 MHz 5.4ns 1.5ns 0.8ns -7E 133 MHz 5.4ns 1.5ns 0.8ns -75 100 MHz 6ns 1.5ns 0.8ns 09005aef848d99e8 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 256Mb ait aat sdr esg.pdf - Rev. D 6/18 EN 2012 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.256Mb: x4, x8, x16 Automotive SDRAM Features Table 2: Address Table 16 Meg Parameter 64 Meg x 4 32 Meg x 8 x 16 Configuration 16 Meg x 4 x 4 banks 8 Meg x 8 x 4 banks 4 Meg x 16 x 4 banks Refresh count 8K 8K 8K Row addressing 8K A 12:0 8K A 12:0 8K A 12:0 Bank addressing 4 BA 1:0 4 BA 1:0 4 BA 1:0 Column 2K A 9:0, 11 1K A 9:0 512 A 8:0 addressing Table 3: 256Mb SDR Part Numbering Part Numbers Architecture Package MT48LC64M4A2TG 64 Meg x 4 54-pin TSOP II MT48LC64M4A2P 64 Meg x 4 54-pin TSOP II 1 MT48LC64M4A2FB 64 Meg x 4 60-ball FBGA 1 MT48LC64M4A2BB 64 Meg x 4 60-ball FBGA MT48LC32M8A2TG 32 Meg x 8 54-pin TSOP II MT48LC32M8A2P 32 Meg x 8 54-pin TSOP II 1 MT48LC32M8A2FB 32 Meg x 8 60-ball FBGA 1 MT48LC32M8A2BB 32 Meg x 8 60-ball FBGA MT48LC16M16A2TG 16 Meg x 16 54-pin TSOP II MT48LC16M16A2P 16 Meg x 16 54-pin TSOP II MT48LC16M16A2FG 16 Meg x 16 54-ball FBGA MT48LC16M16A2BG 16 Meg x 16 54-ball FBGA Note: 1. FBGA Device Decoder: www.micron.com/decoder. 09005aef848d99e8 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 256Mb ait aat sdr esg.pdf - Rev. D 6/18 EN 2012 Micron Technology, Inc. All rights reserved.