128MB, 256MB, 512MB (x64, SR) 240-Pin DDR2 SDRAM UDIMM Features DDR2 SDRAM UDIMM MT4HTF1664AY 128MB MT4HTF3264AY 256MB MT4HTF6464AY 512MB Figure 1: 240-Pin UDIMM (MO-237 R/C C) Features Module height 30.0mm (1.18in) 240-pin, unbuffered dual in-line memory module (UDIMM) Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, or PC2-6400 128MB (16 Meg x 64), 256MB (32 Meg x 64), 512MB (64 Meg x 64) Options Marking V = V = 1.8V DD DDQ Operating temperature V = 1.73.6V DDSPD None Commercial (0C T +70C) A JEDEC-standard 1.8V I/O (SSTL 18-compatible) 1 I Industrial (40C T +85C) A Differential data strobe (DQS, DQS ) option Package 4n-bit prefetch architecture 240-pin DIMM (lead-free) Y 2 Multiple internal device banks for concurrent Frequency/CL 4 operation 2.5ns CL = 5 (DDR2-800) -80E 4 Programmable CAS latency (CL) 2.5ns CL = 6 (DDR2-800) -800 3.0ns CL = 5 (DDR2-667) -667 Posted CAS additive latency (AL) 3 t 3.75ns CL = 4 (DDR2-533) -53E WRITE latency = READ latency - 1 CK 3 5.0ns CL = 3 (DDR2-400) -40E Programmable burst lengths (BL): 4 or 8 1. Contact Micron for industrial temperature Notes: Adjustable data-output drive strength module offerings. 64ms, 8192-cycle refresh 2. CL = CAS (READ) latency. On-die termination (ODT) 3. Contact Micron for product availability. Serial presence detect (SPD) with EEPROM 4. Not available in 128MB and 256MB. Gold edge contacts Single rank Table 1: Key Timing Parameters Data Rate (MT/s) t t t Speed Industry RCD RP RC Grade Nomenclature CL = 6 CL = 5 CL = 4 CL = 3 (ns) (ns) (ns) -80E PC2-6400 800 800 533 400 12.5 12.5 55 -800 PC2-6400 800 667 533 400 15 15 55 -667 PC2-5300 667 553 400 15 15 55 -53E PC2-4200 553 400 15 15 55 -40E PC2-3200 400 400 15 15 55 PDF: 09005aef80ed6fda Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 htf4c16 32 64x64ay Rev. H 3/10 EN 2003 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.128MB, 256MB, 512MB (x64, SR) 240-Pin DDR2 SDRAM UDIMM Features Table 2: Addressing Parameter 128MB 256MB 512MB Refresh count 8K 8K 8K Row address 8K A 12:0 8K A 12:0 8K A 12:0 Device bank address 4 BA 1:0 4 BA 1:0 8 BA 2:0 Device configuration 256Mb (16 Meg x 16) 512Mb (32 Meg x 16) 1Gb (64 Meg x 16) Column address 512 A 8:0 1K A 9:0 1K A 9:0 Module rank address 1 S0 1 S0 1 S0 Table 3: Part Numbers and Timing Parameters 128MB Modules (End of Life) 1 Base device: MT47H16M16, 256Mb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT4HTF1664A(I)Y-667 128MB 16 Meg x 64 5.3 GB/s 3.0ns/667 MT/s 5-5-5 MT4HTF1664A(I)Y-53E 128MB 16 Meg x 64 4.3 GB/s 3.75ns/533 MT/s 4-4-4 MT4HTF1664A(I)Y-40E 128MB 16 Meg x 64 3.2 GB/s 5.0ns/400 MT/s 3-3-3 Table 4: Part Numbers and Timing Parameters 256MB Modules 1 Base device: MT47H32M16, 512Mb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT4HTF3264A(I)Y-80E 256MB 32 Meg x 64 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT4HTF3264A(I)Y-800 256MB 32 Meg x 64 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT4HTF3264A(I)Y-667 256MB 32 Meg x 64 5.3 GB/s 3.0ns/667 MT/s 5-5-5 MT4HTF3264A(I)Y-53E 256MB 32 Meg x 64 4.3 GB/s 3.75ns/533 MT/s 4-4-4 MT4HTF3264A(I)Y-40E 256MB 32 Meg x 64 3.2 GB/s 5.0ns/400 MT/s 3-3-3 Table 5: Part Numbers and Timing Parameters 512MB Modules 1 Base device: MT47H64M16, 1Gb DDR2 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT4HTF6464A(I)Y-80E 512MB 64 Meg x 64 6.4 GB/s 2.5ns/800 MT/s 5-5-5 MT4HTF6464A(I)Y-800 512MB 64 Meg x 64 6.4 GB/s 2.5ns/800 MT/s 6-6-6 MT4HTF6464A(I)Y-667 512MB 64 Meg x 64 5.3 GB/s 3.0ns/667 MT/s 5-5-5 MT4HTF6464A(I)Y-53E 512MB 64 Meg x 64 4.3 GB/s 3.75ns/533 MT/s 4-4-4 MT4HTF6464A(I)Y-40E 512MB 64 Meg x 64 3.2 GB/s 5.0ns/400 MT/s 3-3-3 1. The data sheet for the base device can be found on Microns Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT4HTF3264AY-667E1. PDF: 09005aef80ed6fda Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 htf4c16 32 64x64ay Rev. H 3/10 EN 2003 Micron Technology, Inc. All rights reserved.