128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM Features DDR SDRAM SODIMM MT4VDDT1664H 128MB MT4VDDT3264H 256MB For component data sheets, refer to Microns Web site: www.micron.com Figure 1: 200-Pin SODIMM (MO-224) Features 200-pin, small-outline dual in-line memory module PCB height: 31.75mm (1.25in) (SODIMM) Fast data transfer rates: PC2100, PC2700, or PC3200 128MB (16 Meg x 64) or 256MB (32 Meg x 64) Vdd = Vddq = +2.5V (-40B: Vdd = Vddq = +2.6V) Vddspd = +2.3V to +3.6V 2.5V I/O (SSTL 2-compatible) Internal, pipelined double data rate (DDR) 2n-prefetch architecture Bidirectional data strobe (DQS) transmitted/ received with datathat is, source-synchronous data capture Differential clock inputs (CK and CK ) Options Marking Multiple internal device banks for concurrent 1 Operating temperature operation Commercial (0C T +70C) None Single rank A Industrial (40C T +85C) I Selectable burst lengths (BL): 2, 4, or 8 A Package Auto precharge option 200-pin DIMM (standard) G Auto refresh and self refresh modes: 7.8125s 200-pin DIMM (Pb-free) Y maximum average periodic refresh interval Memory clock, speed, CAS latency Serial presence-detect (SPD) with EEPROM 5ns (200 MHz), 400 MT/s, CL = 3 -40B Selectable CAS latency (CL) for maximum 6ns (167 MHz), 333 MT/s, CL = 2.5 -335 compatibility 2 7.5ns (133 MHz), 266 MT/s, CL = 2 -26A Gold edge contacts 2 7.5ns (133 MHz), 266 MT/s, CL = 2.5 -265 Notes: 1. Contact Micron for industrial temperature module offerings. 2. Not recommended for new designs. Table 1: Key Timing Parameters Data Rate (MT/s) t t t Speed Industry RCD RP RC Grade Nomenclature CL = 3 CL = 2.5 CL = 2 (ns) (ns) (ns) Notes -40B PC3200 400 333 266 15 15 55 -335 PC2700 333 266 18 18 60 1 -26A PC2100 266 266 20 20 65 -265 PC2100 266 200 20 20 65 t t Notes: 1. The values of RCD and RP for -335 modules show 18ns to align with industry specifications actual DDR SDRAM device specifications are 15ns. PDF: 09005aef837131bb/Source: 09005aef8086ea0b Micron Technology, Inc., reserves the right to change products or specifications without notice. dd4c16 32x64h.fm - Rev. E 10/08 EN 1 2003 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. 128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM Features Table 2: Addressing Parameter 128MB 256MB Refresh count 8K 8K Row address 8K (A0A12) 8K (A0A12) Device bank address 4 (BA0, BA1) 4 (BA0, BA1) Device configuration 256Mb (16 Meg x 16) 512Mb (32 Meg x 16) Column address 512 (A0A8) 1K (A0A9) Module rank address 1 (S0 ) 1 (S0 ) Table 3: Part Numbers and Timing Parameters 128MB Modules 1 Base device: MT46V16M16, 256Mb DDR SDRAM Module Module Memory Clock/ Clock Latency 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT4VDDT1664HG-40B 128MB 16 Meg x 64 3.2 GB/s 5ns/400 MT/s 3-3-3 MT4VDDT1664HY-40B 128MB 16 Meg x 64 3.2 GB/s 5ns/400 MT/s 3-3-3 MT4VDDT1664HG-335 128MB 16 Meg x 64 2.7 GB/s 6ns/333 MT/s 2.5-3-3 MT4VDDT1664HY-335 128MB 16 Meg x 64 2.7 GB/s 6ns/333 MT/s 2.5-3-3 MT4VDDT1664HG-26A 128MB 16 Meg x 64 2.1 GB/s 7.5ns/266 MT/s 2-3-3 MT4VDDT1664HG-265 128MB 16 Meg x 64 2.1 GB/s 7.5ns/266 MT/s 2.5-3-3 MT4VDDT1664HY-265 128MB 16 Meg x 64 2.1 GB/s 7.5ns/266 MT/s 2.5-3-3 Table 4: Part Numbers and Timing Parameters 256MB Modules 1 Base device: MT46V32M16, 512Mb DDR SDRAM Module Module Memory Clock/ Clock Latency 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT4VDDT3264HG-40B 256MB 32 Meg x 64 3.2 GB/s 5ns/400 MT/s 3-3-3 MT4VDDT3264HY-40B 256MB 32 Meg x 64 3.2 GB/s 5ns/400 MT/s 3-3-3 256MB 32 Meg x 64 2.7 GB/s 6ns/333 MT/s 2.5-3-3 MT4VDDT3264HG-335 256MB 32 Meg x 64 2.7 GB/s 6ns/333 MT/s 2.5-3-3 MT4VDDT3264HY-335 MT4VDDT3264HG-265 256MB 32 Meg x 64 2.1 GB/s 7.5ns/266 MT/s 2.5-3-3 Notes: 1. The data sheets for the base devices can be found on Microns Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT4VDDT3264HY-40BF2. PDF: 09005aef837131bb/Source: 09005aef8086ea0b Micron Technology, Inc., reserves the right to change products or specifications without notice. dd4c16 32x64h.fm - Rev. E 10/08 EN 2 2003 Micron Technology, Inc. All rights reserved.