4GB (x64, SR) 288-Pin DDR4 UDIMM Features DDR4 SDRAM UDIMM MTA4ATF51264AZ 4GB Figure 1: 288-Pin UDIMM (MO-309 R/C C) Features Module height: 31.25mm (1.23in) DDR4 functionality and operations supported as defined in the component data sheet 288-pin, unbuffered dual in-line memory module (UDIMM) Fast data transfer rates: PC4-3200, PC4-2666, or PC4-2400 Options Marking 4GB (512 Meg x 64) Operating temperature V = 1.20V (NOM) DD Commercial (0C T 95C) None OPER V = 2.5V (NOM) PP Package V = 2.5V (NOM) DDSPD 288-pin DIMM (halogen-free) Z Nominal and dynamic on-die termination (ODT) for Frequency/CAS latency data, strobe, and mask signals 0.62ns CL = 22 (DDR4-3200) -3G2 Low-power auto self refresh (LPASR) 0.75ns CL = 19 (DDR4-2666) -2G6 0.83ns CL = 17 (DDR4-2400) -2G3 Data bus inversion (DBI) for data bus On-die V generation and calibration REFDQ Single-rank 2 On-board I C serial presence-detect (SPD) EEPROM 8 internal banks 2 groups of 4 banks each Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Gold edge contacts Halogen-free Fly-by topology Terminated control command and address bus Table 1: Key Timing Parameters Data Rate (MT/s) CL = t t t 22/ RCD RP RC PC4- 24 21 20 19 18 17 16 15 14 13 12 11 10 9 (ns) (ns) (ns) -3G2 3200 3200 3200/ 2666 2666 2666, 2400 2133 2133 1866 1866 1600 1600 1333 13.75 13.75 45.75 2400 -2G9 2933 2933/ 2666 2666 2400 2400 2133 2133 1866 1866 1600 1600 14.32 14.32 46.32 2933 -2G6 2666 2666 2666 2666 2400 2133 2133 1866 1866 1600 1600 1333 14.16 14.16 46.16 -2G3 2400 2400 2400 2133 2133 1866 1866 1600 1600 1333 14.16 14.16 46.16 -2G1 2133 2133 2133 1866 1866 1600 1600 1333 13.5 13.5 46.5 CCMTD-1725822587-10266 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 atf4c512x64az.pdf Rev. C 5/17 EN 2016 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. Speed Grade4GB (x64, SR) 288-Pin DDR4 UDIMM Features Table 2: Addressing Parameter 4GB Row address 64K A 15:0 Column address 1K A 9:0 Device bank group address 2 BG0 Device bank address per group 4 BA 1:0 Device configuration 8Gb (512 Meg x 16), 8 banks Module rank address CS0 n Table 3: Part Numbers and Timing Parameters 4GB Modules 1 Base device: MT40A512M16, 8Gb DDR4 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MTA4ATF51264AZ-3G2 4GB 512 Meg x 64 25.6 GB/s 0.62ns/3200 MT/s 22-22-22 MTA4ATF51264AZ-2G6 4GB 512 Meg x 64 21.3 GB/s 0.75ns/2666 MT/s 19-19-19 MTA4ATF51264AZ-2G3 4GB 512 Meg x 64 19.2 GB/s 0.83ns/2400 MT/s 17-17-17 Notes: 1. The data sheet for the base device can be found on micron.com. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MTA4ATF51264AZ-3G2E1. CCMTD-1725822587-10266 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 atf4c512x64az.pdf Rev. C 5/17 EN 2016 Micron Technology, Inc. All rights reserved.