BC55PA Nexperia

BCP55 BCX55 BC55PA 60 V, 1 A NPN medium power transistors Rev. 8 24 October 2011 Product data sheet 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview 1 Type number Package PNP complement NXP JEITA JEDEC BCP55 SOT223 SC-73 - BCP52 BCX55 SOT89 SC-62 TO-243 BCX52 BC55PA SOT1061 - - BC52PA 1 Valid for all available selection groups. 1.2 Features and benefits High current Three current gain selections High power dissipation capability Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061) Leadless very small SMD plastic package with medium power capability (SOT1061) AEC-Q101 qualified 1.3 Applications Linear voltage regulators Power management Low-side switches MOSFET drivers Battery-driven devices Amplifiers 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit collector-emitter voltage open base - - 60 V V CEO collector current - - 1 A I C peak collector current single pulse t 1ms --2 A I CM p 1 DC current gain V =2V I =150 mA 63 - 250 h FE CE C 1 selection -10 V =2V I =150 mA 63 - 160 h FE CE C 1 selection -16 V =2V I =150 mA 100 - 250 h FE CE C 1 Pulse test: t 300 s = 0.02. pBCP55 BCX55 BC55PA NXP Semiconductors 60 V, 1 A NPN medium power transistors 2. Pinning information Table 3. Pinning Pin Description Simplified outline Graphic symbol SOT223 1base 2, 4 4 2 collector 3emitter 1 4 collector 132 3 sym016 SOT89 1emitter 2 2 collector 3 3base 1 321 sym042 SOT1061 1base 3 3 2emitter 3 collector 1 2 sym021 12 Transparent top view 3. Ordering information Table 4. Ordering information 1 Type number Package Name Description Version BCP55 SC-73 plastic surface-mounted package with increased SOT223 heatsink 4 leads BCX55 SC-62 plastic surface-mounted package exposed die pad for SOT89 good heat transfer 3 leads BC55PA HUSON3 plastic thermal enhanced ultra thin small outline SOT1061 package no leads 3 terminals body 2 2 0.65 mm 1 Valid for all available selection groups. BCP55 BCX55 BC55PA All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 24 October 2011 2 of 22