74AUP1G17GF,132 NXP

74AUP1G17 Low-power Schmitt trigger Rev. 8 15 January 2015 Product data sheet 1. General description The 74AUP1G17 provides the single Schmitt trigger buffer. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. This device ensures a very low static and dynamic power consumption across the entire V range from 0.8 V to 3.6 V. CC This device is fully specified for partial Power-down applications using I . OFF The I circuitry disables the output, preventing the damaging backflow current through OFF the device when it is powered down. The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage V and the negative voltage V is defined as the input T+ T hysteresis voltage V . H 2. Features and benefits Wide supply voltage range from 0.8 V to 3.6 V High noise immunity ESD protection: HBM JESD22-A114F Class 3A exceeds 5000 V MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1000 V Low static power consumption I = 0.9 A (maximum) CC Latch-up performance exceeds 100 mA per JESD 78 Class II Inputs accept voltages up to 3.6 V Low noise overshoot and undershoot < 10 % of V CC I circuitry provides partial Power-down mode operation OFF Multiple package options Specified from 40 Cto+85 C and 40 Cto+125 C74AUP1G17 NXP Semiconductors Low-power Schmitt trigger 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP1G17GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package 5 leads SOT353-1 body width 1.25 mm 74AUP1G17GM 40 C to +125 C XSON6 plastic extremely thin small outline package no leads SOT886 6 terminals body 1 1.45 0.5 mm 74AUP1G17GF 40 C to +125 C XSON6 plastic extremely thin small outline package no leads SOT891 6 terminals body 1 1 0.5 mm 74AUP1G17GN 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1115 6 terminals body 0.9 1.0 0.35 mm 74AUP1G17GS 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1202 6 terminals body 1.0 1.0 0.35 mm 74AUP1G17GX 40 C to +125 C X2SON5 X2SON5: plastic thermal enhanced extremely thin SOT1226 small outline package no leads 5 terminals body 0.8 0.8 0.35 mm 4. Marking Table 2. Marking 1 Type number Marking code 74AUP1G17GW pJ 74AUP1G17GM pJ 74AUP1G17GF pJ 74AUP1G17GN pJ 74AUP1G17GS pJ 74AUP1G17GX pJ 1 The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram < E PQ PQ Fig 1. Logic symbol Fig 2. IEC logic symbol < E P Q Fig 3. Logic diagram 74AUP1G17 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 8 15 January 2015 2 of 24 E