74LVC1G125GF,132 NXP

74LVC1G125 Bus buffer/line driver 3-state Rev. 11 2 July 2012 Product data sheet 1. General description The 74LVC1G125 provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A HIGH-level at pin OE causes the output to assume a high-impedance OFF-state. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using I . The I OFF OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range from 1.65 V to 5.5 V High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8-B/JESD36 (2.7 V to 3.6 V) 24 mA output drive (V =3.0 V) CC ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V CMOS low power consumption Inputs accept voltages up to 5 V Latch-up performance exceeds 250 mA Direct interface with TTL levels Multiple package options Specified from 40 Cto+85 C and 40 Cto+125 C74LVC1G125 NXP Semiconductors Bus buffer/line driver 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G125GW 40 Cto+125 C TSSOP5 plastic thin shrink small outline package 5 leads SOT353-1 body width 1.25 mm 74LVC1G125GV 40 Cto+125 C SC-74A plastic surface-mounted package 5 leads SOT753 74LVC1G125GM 40 Cto+125 C XSON6 plastic extremely thin small outline package SOT886 no leads 6 terminals body 1 1.45 0.5 mm 74LVC1G125GF 40 C to +125 C XSON6 plastic extremely thin small outline package SOT891 no leads 6 terminals body 1 1 0.5 mm 74LVC1G125GN 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1115 6 terminals body 0.9 1.0 0.35 mm 74LVC1G125GS 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1202 6 terminals body 1.0 1.0 0.35 mm 74LVC1G125GX 40 C to +125 C X2SON5 X2SON5: plastic thermal enhanced extremely thin SOT1226 small outline package no leads 5 terminals body 0.8 0.8 0.35 mm 4. Marking Table 2. Marking 1 Type number Marking code 74LVC1G125GW VM 74LVC1G125GV V25 74LVC1G125GM VM 74LVC1G125GF VM 74LVC1G125GN VM 74LVC1G125GS VM 74LVC1G125GX VM 1 The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram AY 4 2 Y A 2 4 1 OE 1 EN OE mna118 mna119 mna120 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram 74LVC1G125 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 11 2 July 2012 2 of 20