X-On Electronics has gained recognition as a prominent supplier of 88Q9098RA1-NYI2A0R1 RF System on a Chip - SoC across the USA, India, Europe, Australia, and various other global locations. 88Q9098RA1-NYI2A0R1 RF System on a Chip - SoC are a product manufactured by NXP. We provide cost-effective solutions for RF System on a Chip - SoC, ensuring timely deliveries around the world.

88Q9098RA1-NYI2A0R1 NXP

88Q9098RA1-NYI2A0R1 electronic component of NXP
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Part No.88Q9098RA1-NYI2A0R1
Manufacturer: NXP
Category: RF System on a Chip - SoC
Description: RF System on a Chip - SoC
Datasheet: 88Q9098RA1-NYI2A0R1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Obsolete
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MOQ : 840
Multiples : 840
840 : USD 16.6635
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Obsolete
   
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We are delighted to provide the 88Q9098RA1-NYI2A0R1 from our RF System on a Chip - SoC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 88Q9098RA1-NYI2A0R1 and other electronic components in the RF System on a Chip - SoC category and beyond.

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Built for Next-Generation Connected Vehicles NXPi.MX 6SoloX 88Q9098 applications prConcurrent Wi-Fiocessors 6 and could with Bluetoothbe on 5 BLE SoCtwo lines The new 88Q9098 wireless SoC family extends NXP leadership in providing comprehensive 802.11ax solutions by enabling gigabit-level performance, superior reliability and enhanced security for automotive applications. PRODUCT OVERVIEW The 88Q9098x family of footprint-compatible wireless solutions include: Delivering reliable, high-performance wireless connectivity is becoming more difficult in todays increasingly congested 2 x 2 + 2 x 2 concurrent dual Wi-Fi with Bluetooth 5 automobile environment. To meet this challenge, the new (88Q9098A) NXP 88Q9098x product line features 802.11ax solutions with 2 x 2 Wi-Fi + 2 x 2 802.11p concurrent operation 2 x 2 plus 2 x 2 concurrent dual Wi-Fi, dual-mode Bluetooth with Bluetooth 5 (88Q9098P) 5/ Bluetooth LE and 802.11p for connected vehicles. Our 2 x 2 + 2 x 2 concurrent dual Wi-Fi or 2 x 2 Wi-Fi + 2 x 2 innovative concurrent dual Wi-Fi architecture sets a new 802.11p concurrent operation with Bluetooth 5 (88Q9098S) technology precedent, integrating two complete Wi-Fi subsystems into a single SoC and enabling two independent 2 x 2 data streams to run concurrently and at full throughput. The wireless combo solution also has a robust set of features including 802.11p with an on-chip elliptic curve cryptography (ECC) hardware accelerator and Bluetooth LE long-range. ECC enables safe and secure vehicle-to-everything (V2X) communication and Bluetooth LE long-range provides long-distance mobile connectivity for a wide variety of automotive applications from IVI to TCU.Host Interface TARGET APPLICATIONS KEY FEATURES AND BENEFITS In-Vehicle infotainment (IVI) FEATURES BENEFITS Concurrent dual Wi-Fi operating modes for various Telecommunications control automotive applications unit (TCU) General Features AEC-Q100 grade 2 support (from -40 C up to + 105 C) with external power amplifiers Remote diagnostics 11 x 11 mm, 148-pin DR-QFN package Advanced driver assistance 2 x 2 IEEE 802.11ax 2 x 2 IEEE 802.11ac systems (ADAS) Support 20/40/80/(80+80) MHz channel bandwidths WLAN Connected gateway (C-GW) Uplink and downlink OFDMA and MU-MIMO 1024 QAM Vehicle-to-Everything (V2X) Instantaneous 0-DFS communication On-chip elliptic curve cryptography (ECC) hardware acceleration for secure V2X applications DSRC Maximum ratio combining (MRC) and cyclic shift diversity (CSD) technologies to maximize range and performance of 802.11p for V2X communication 2 x wide band speech (WBS) calls 2 Mbit/s LE Bluetooth 5 Long range LTE coexistence arbitration 802.11mc Bluetooth LE angle of arrival (AoA)/angle of departure (AoD) Precision Location Distance: within 1 meter Angle: within 10 degree PCIe 3.0 Host Interfaces SDIO 3.0 high speed UART (for Bluetooth only) 88Q9098x BLOCK DIAGRAM 88Q9098X BLOCK DIAGRAM 2 x 2 802.11 ax / T/R RF Crossbar 802.11p 2 x 2 5G PCIe 3.0 RF Baseband MAC T/R Wi-Fi CPU SDIO 3.0 2 x 2 802.11 ax / T/R 802.11p 2 x 2 2.4 G RF UART Baseband MAC T/R (Bluetooth only) RT CPU 2 I S / PCM Bluetooth Dual-Mode Bluetooth RF 3.3 V 1.8 V 3.3 V Power Regulator LTE Coexistence MWS 1.8 V www.nxp.com NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by NXP Semiconductors is under license. 2019 NXP B.V. Document Number: M88Q9098 REV 0

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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