BAP50-04,215 NXP

BAP50-04 Silicon PIN diode Rev. 3.1 8 February 2019 Product data sheet 1 Product profile 1.1 General description Two planar PIN diodes in series configuration in an SOT23 small plastic SMD package. 1.2 Features and benefits Two elements in series configuration in a small-sized plastic SMD package Low diode capacitance Low diode forward resistance 1.3 Applications General RF applicationNXP Semiconductors BAP50-04 Silicon PIN diode 2 Pinning information Table 1.Discrete pinning Pin Description Simplified outline Graphic symbol 1 anode 3 3 2 cathode 1 2 3 common connection aaa-025249 1 2 Top view 3 Ordering information Table 2.Ordering information Type number Package Name Description Version BAP50-04 - plastic surface-mounted package 3 leads SOT23 4 Marking Table 3.Marking code Type number Marking code BAP50-04 4L% 5 Limiting values Table 4.Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 50 V R I forward current - 50 mA F P total power dissipation T 90 C - 250 mW tot sp T storage temperature -65 +150 C stg T junction temperature -65 +150 C j 6 Thermal characteristics Table 5.Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from 220 K/W th(j-sp) junction to solder point BAP50-04 All information provided in this document is subject to legal disclaimers. NXP B.V. 2019. All rights reserved. Product data sheet Rev. 3.1 8 February 2019 2 / 9