BAP51-03,115 NXP

BAP51-03 Silicon PIN diode Rev. 5.1 8 February 2019 Product data sheet 1 Product profile 1.1 General description General-purpose pin diode in an SOD323 small plastic SMD package. 1.2 Features and benefits Low diode capacitance: maximum 1.05 pF Low diode forward resistance: max. 0.7 AEC-Q101 qualified 1.3 Applications General RF applications 2 Pinning information Table 1.Discrete pinning Pin Description Simplified outline Graphic symbol 1 cathode 1 2 2 anode sym006 Top view 3 Ordering information Table 2.Ordering information Type number Package Name Description Version BAP51-03 - plastic surface-mounted package 2 leads SOD323 4 Marking Table 3.Marking code Type number Marking code 1 BAP51-03 A5 1 The marking bar indicates the cathode (see simplified outline graphic in Table 1).NXP Semiconductors BAP51-03 Silicon PIN diode 5 Limiting values Table 4.Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V continuous reverse - 50 V R voltage I continuous forward - 50 mA F current P total power dissipation T 90 C - 500 mW tot sp T storage temperature -65 +150 C stg T junction temperature -65 +150 C j 6 Thermal characteristics Table 5.Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to 120 K/W th(j-sp) solder point BAP51-03 All information provided in this document is subject to legal disclaimers. NXP B.V. 2019. All rights reserved. Product data sheet Rev. 5.1 8 February 2019 2 / 9