X-On Electronics has gained recognition as a prominent supplier of DSP56311VL150 Digital Signal Processors & Controllers - DSP, DSC across the USA, India, Europe, Australia, and various other global locations. DSP56311VL150 Digital Signal Processors & Controllers - DSP, DSC are a product manufactured by NXP. We provide cost-effective solutions for Digital Signal Processors & Controllers - DSP, DSC, ensuring timely deliveries around the world.

DSP56311VL150 NXP

DSP56311VL150 electronic component of NXP
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Part No.DSP56311VL150
Manufacturer: NXP
Category: Digital Signal Processors & Controllers - DSP, DSC
Description: Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP PBFREE
Datasheet: DSP56311VL150 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
126: USD 52.4753 ea
Line Total: USD 6611.89 
Availability - 0
MOQ: 126  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Mon. 11 Nov to Fri. 15 Nov
MOQ : 126
Multiples : 1
126 : USD 52.4753

0
Ship by Mon. 11 Nov to Fri. 15 Nov
MOQ : 1
Multiples : 1
1 : USD 53.9955

0
Ship by Mon. 11 Nov to Fri. 15 Nov
MOQ : 126
Multiples : 126
126 : USD 60.326

   
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We are delighted to provide the DSP56311VL150 from our Digital Signal Processors & Controllers - DSP, DSC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DSP56311VL150 and other electronic components in the Digital Signal Processors & Controllers - DSP, DSC category and beyond.

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DSP56311 Freescale Semiconductor Rev. 8, 2/2005 Technical Data DSP56311 24-Bit Digital Signal Processor 3 16 6 6 Memory Expansion Area The DSP56311 is intended for applications requiring a Program RAM large amount of internal Triple SCI HI08 ESSI EFCOP 32 K 24 bits Timer or X Data Y Data memory, such as networking 31 K 24 bits RAM RAM and 48 K 24 bits 48 K 24 bits and wireless infrastructure Instruction Cache applications. The onboard 1024 24 bits Peripheral EFCOP can accelerate Expansion Area general filtering applications, YAB Address External XAB such as echo-cancellation 18 Generation Address Unit PAB Bus applications, correlation, and Address Six Channel DAB Switch DMA Unit general-purpose convolution- External 24-Bit Bus 13 based algorithms. Interface Bootstrap DSP56300 and ROM I - Cache Control Core Control DDB External YDB Internal 24 Whats New Data XDB Data Bus Rev. 8 includes the following Bus PDB Switch Data GDB Switch changes: Adds lead-free packaging and Power Management part numbers. Data ALU 5 Program Program Program Clock + 24 24 56 56-bit MAC JTAG PLL Interrupt Decode Address Generator Two 56-bit Accumulators Controller Controller Generator OnCE 56-bit Barrel Shifter DE EXTAL MODA/IRQA XTAL MODB/IRQB PCAP RESET MODC/IRQC PINIT/NMI MODD/IRQD Figure 1. DSP56311 Block Diagram The Freescale DSP56311, a member of the DSP56300 DSP family, supports network applications with general filtering operations. The Enhanced Filter Coprocessor (EFCOP) executes filter algorithms in parallel with core operations enhancing signal quality with no impact on channel throughput or total channels supported. The result is increased overall performance. Like the other DSP56300 family members, the DSP56311 uses a high-performance, single-clock-cycle-per- instruction engine (DSP56000 code-compatible), a barrel shifter, 24-bit addressing, an instruction cache, and a direct memory access (DMA) controller (see Figure 1). The DSP56311 performs at up to 150 million multiply-accumulates per second (MMACS), attaining up to 300 MMACS when the EFCOP is in use. It operates with an internal 150 MHz clock with a 1.8 volt core and independent 3.3 volt input/output (I/O) power. Freescale Semiconductor, Inc., 1999, 2005. All rights reserved. PIO EB PM EB XM EB YM EBTable of Contents Data Sheet Conventions.......................................................................................................................................ii Features...............................................................................................................................................................iii Target Applications .............................................................................................................................................iv Product Documentation ......................................................................................................................................iv Chapter 1 Signals/Connections 1.1 Power ................................................................................................................................................................1-3 1.2 Ground ..............................................................................................................................................................1-3 1.3 Clock.................................................................................................................................................................1-3 1.5 External Memory Expansion Port (Port A) ......................................................................................................1-4 1.6 Interrupt and Mode Control ..............................................................................................................................1-7 1.7 Host Interface (HI08)........................................................................................................................................1-8 1.8 Enhanced Synchronous Serial Interface 0 (ESSI0) ........................................................................................1-11 1.9 Enhanced Synchronous Serial Interface 1 (ESSI1) ........................................................................................1-12 1.10 Serial Communication Interface (SCI) ...........................................................................................................1-13 1.11 Timers .............................................................................................................................................................1-14 1.12 JTAG and OnCE Interface ..............................................................................................................................1-15 Chapter 2 Specifications 2.1 Maximum Ratings.............................................................................................................................................2-1 2.2 Thermal Characteristics ....................................................................................................................................2-2 2.3 DC Electrical Characteristics............................................................................................................................2-3 2.4 AC Electrical Characteristics............................................................................................................................2-4 Chapter 3 Packaging 3.1 Package Description .........................................................................................................................................3-2 3.2 MAP-BGA Package Mechanical Drawing .....................................................................................................3-10 Chapter 4 Design Considerations 4.1 Thermal Design Considerations........................................................................................................................4-1 4.2 Electrical Design Considerations......................................................................................................................4-2 4.3 Power Consumption Considerations.................................................................................................................4-3 4.4 PLL Performance Issues ...................................................................................................................................4-4 4.5 Input (EXTAL) Jitter Requirements .................................................................................................................4-6 Appendix A Power Consumption Benchmark Data Sheet Conventions OVERBAR Indicates a signal that is active when pulled low (For example, the RESET pin is active when low.) asserted Means that a high true (active high) signal is high or that a low true (active low) signal is low deasserted Means that a high true (active high) signal is low or that a low true (active low) signal is high Examples: Signal/Symbol Logic State Signal State Voltage PIN V /V True Asserted IL OL PIN V /V False Deasserted IH OH PIN V /V True Asserted IH OH PIN V /V False Deasserted IL OL Note: Values for V , V , V , and V are defined by individual product specifications. IL OL IH OH DSP56311 Technical Data, Rev. 8 ii Freescale Semiconductor

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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Freescale Semiconductor - NXP
NXP
NXP Freescale
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NXP / Freescale
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NXP Semiconductors
NXP USA Inc.
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