Document Number: MC10XS3412 NXP Semiconductors Rev. 13.0, 8/2018 Technical Data Quad high-side switch 10XS3412 (dual 10 mOhm, dual 12 mOhm) The 10XS3412 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (dual 10 mOhm/dual DS(on) 12 mOhm) can control four separate 55/28 W bulbs, and/or Xenon modules, and/or LEDs. HIGH-SIDE SWITCH Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew rate improves electromagnetic compatibility (EMC) behavior. Additionally, each output has its own parallel input or SPI control for pulse-width modulation (PWM) control. The 10XS3412 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide functionality of the outputs in case of MCU damage. Features Four protected 10 m and 12 m high-side switches (at 25 C) FK SUFFIX (PB-FREE) FK SUFFIX (PB-FREE) Operating voltage range of 6.0 to 20 V with sleep current < 5.0 A, 98ARL10596D 98ASA00426D extended mode from 4.0 to 28 V 24-PIN PQFN 24-PIN PQFN 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy chain capability PWM module using external clock or calibratable internal oscillator with programmable outputs delay management Smart overcurrent shutdown, severe short-circuit, overtemperature protection with time limited autoretry, and Fail-safe mode in case of MCU damage Output OFF or ON openload detection compliant to bulbs or LEDs and short to battery detection Analog current feedback with selectable ratio and board temperature feedback V V V V V DD PWR DD PWR DD 10XS3412 VDD VPWR HS0 WAKE LOAD I/O FS SCLK SCLK CS CS HS1 SI SO LOAD I/O RST SO SI MCU HS2 I/O IN0 LOAD I/O IN1 I/O IN2 I/O IN3 HS3 LOAD A/D CSNS FSI GND GND Figure 1. 10XS3412 simplified application diagram NXP B.V. 2018.Table of Contents 1 Orderable parts 3 2 Device variations . 3 3 Internal block diagram . 4 4 Pin connections 5 5 Electrical characteristics . 7 5.1 Maximum ratings . 7 5.2 Static electrical characteristics . 9 5.3 Dynamic electrical characteristics 14 5.4 Timing diagrams . 21 6 Functional description 24 6.1 Introduction . 24 6.2 Functional pin description 24 6.3 Functional internal block description 26 7 Functional device operation 27 7.1 SPI protocol description . 27 7.2 Operational modes . 27 7.3 Protection and diagnostic features . 32 7.4 Logic commands and registers 36 8 Typical applications 44 9 Packaging . 45 9.1 Soldering information . 45 9.2 Package mechanical dimensions 45 10 Additional documentation . 54 10.1Thermal addendum (Rev 2.0) . 54 11 Revision history . 59 10XS3412 2 NXP Semiconductors