NXP Semiconductors MKW39A512 Data Sheet: Technical Data Rev. 7, 03/2020 MKW39/38/37 Data Sheet MKW39A512VFT4 An ultra low-power, highly integrated Bluetooth Low MKW38A512VFT4 Energy 5.0 wireless microcontroller MKW38Z512VFT4 MKW37A512VFT4 MKW37Z512VFT4 48Wettabl HVQFN 7x7 mm Pitch 0.5 mm Multi-Standard Radio System peripherals 2.4 GHz Bluetooth Low Energy (Bluetooth LE) version Nine MCU low-power modes to provide power 5.0 compliant supporting up to 8 simultaneous optimization based on application requirements hardware connections and all optional features DC-DC Converter supporting Buck and Bypass including: operating modes High speed (2M PHY) Direct Memory Access (DMA) controller Long range Computer Operating Properly (COP) watchdog Advertising Extension Serial Wire Debug (SWD) Interface and Micro Trace High duty cycle non-connectable advertising buffer Channel selection algorithm 2 Bit Manipulation Engine (BME) Typical Bluetooth LE Receiver Sensitivity Timers Bluetooth LE 2 Mbit/s: 95.5 dBm 16-bit Low-power Timer (LPTMR) Bluetooth LE 1 Mbit/s: 98 dBm 3 Timer/PWM Modules(TPM): One 4 channel TPM Bluetooth LE LR 500 kbit/s: 101 dBm and two 2 channel TPMs Bluetooth LE LR 125 kbit/s: 105 dBm Programmable Interrupt Timer (PIT) Generic FSK modulation Real-Time Clock (RTC) Data Rate: 250, 500, 1000 and 2000 kbit/s Modulations: GFSK BT = 0.5, MSK Communication interfaces Modulation Index: 0.32, 0.5, 0.7, and 1.0 2 Serial Peripheral Interface (SPI) modules Typical Receiver Sensitivity (250 kbit/s GFSK- 2 Inter-integrated Circuit (I2C) modules BT=0.5, h=0.5) = 101 dBm Low-power UART (LPUART) module with LIN Programmable Transmitter Output Power: 30 dBm to support (2x LPUART on KW38) +5 dBm Carrier Modulator Timer (CMT) Low external component count for low-cost application FlexCAN module (with CAN FD support up to 3.2 On-chip balun with single ended bidirectional RF port Mbit/s baudrate) on KW38 NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Analog Modules Security 16-bit Analog-to-Digital Converter (ADC) AES-128 Hardware Accelerator (AESA) 6-bit High-Speed Analog Comparator (CMP) True Random Number Generator (TRNG) 1.2 V Voltage Reference (VREF) Advanced flash security on Program Flash 80-bit unique identification number per chip MCU and Memories 40-bit unique Media Access Control (MAC) sub- 256 KB program flash memory plus 256 KB FlexNVM address on KW39/38 LE Secure Connections 512 KB program flash memory on KW37 8 KB FlexRAM supporting EEPROM emulation on Clocks KW39/38 26 and 32 MHz supported for Bluetooth LE and 8 KB program acceleration RAM on KW37 Generic FSK modes On-chip 64 KB SRAM 32.768 kHz Crystal Oscillator Up to 48 MHz Arm Cortex-M0+ core Operating Characteristics Low-power Consumption Voltage range: 1.71 V to 3.6 V Transceiver current (DC-DC buck mode, 3.6 V supply) Ambient temperature range: 40 to 105 C Typical Rx current: 6.3 mA AEC Q100 Grade 2 Automotive Qualification Typical Tx current: 5.7 mA Industrial Qualification Low-power Mode (VLLS0) Current: 266.6 nA Human-machine Interface (HMI) General-purpose input/output (GPIO) KW39/38/37 Part Numbers 256 KB P- 8 KB Qualification 512 KB Flash/256 Second LPUART Device CAN FD FlexRAM Package Tier P-Flash KB with LIN EEPROM FlexNVM MKW39A512VFT4 Auto AEC-Q100 N N Y N Y 7X7 mm 48- Grade 2 pinWettabl HVQFN MKW38A512VFT4 Auto AEC-Q100 Y N Y Y Y Grade 2 MKW38Z512VFT4 Industrial Y N Y Y Y MKW37A512VFT4 Auto AEC-Q100 N Y N N N Grade 2 MKW37Z512VFT4 Industrial N Y N N N Related Resources Type Description Product Selector The Product Selector lets you find the right Kinetis part for your design. Fact Sheet The Fact Sheet gives overview of the product key features and its uses. Reference Manual The Reference Manual contains a comprehensive description of the structure and function (operation) of a device. Data Sheet The Data Sheet includes electrical characteristics and signal connections. Chip Errata The chip mask set Errata provides additional or corrective information for a particular device mask set. Package drawing Package dimensions are available in package drawings. 2 MKW39/38/37 Data Sheet, Rev. 7, 03/2020 NXP Semiconductors