X-On Electronics has gained recognition as a prominent supplier of MPC5121VY400B Microprocessors - MPU across the USA, India, Europe, Australia, and various other global locations. MPC5121VY400B Microprocessors - MPU are a product manufactured by NXP. We provide cost-effective solutions for Microprocessors - MPU, ensuring timely deliveries around the world.

MPC5121VY400B NXP

MPC5121VY400B electronic component of NXP
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Part No.MPC5121VY400B
Manufacturer: NXP
Category: Microprocessors - MPU
Description: Microprocessors - MPU TELEMATICS PROCESSOR
Datasheet: MPC5121VY400B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 49.5144 ea
Line Total: USD 49.51 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 1
Multiples : 1
1 : USD 49.5144

   
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We are delighted to provide the MPC5121VY400B from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MPC5121VY400B and other electronic components in the Microprocessors - MPU category and beyond.

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Freescale Semiconductor Document Number: MPC5121E Rev. 5, 02/2012 Data Sheet: Technical Data MPC5121E/MPC5123 516 TEPBGA 27 mm x 27 mm MPC5121E/MPC5123 Data Sheet The MPC5121e/MPC5123 integrates a high performance On-chip temperature sensor e300 CPU core based on the Power Architecture Technology IIM IC Identification module with a rich set of peripheral functions focused on communications and systems integration. Major features of the MPC5121e/MPC5123 are: e300 Power Architecture processor core Power modes include doze, nap, sleep, deep sleep, and hibernate AXE Auxiliary Execution Engine MBX Lite 2D/3D graphics engine (not available in MPC5123) DIU Display interface unit DDR1, DDR2, and LPDDR/mobile-DDR SDRAM memory controller MEM 128 KB on-chip SRAM USB 2.0 OTG controller with integrated physical layer (PHY) DMA subsystem EMB Flexible multi-function external memory bus interface NFC NAND flash controller LPC LocalPlus interface 10/100Base Ethernet PCI interface, version 2.3 PATA Parallel ATA integrated development environment (IDE) controller SATA Serial ATA controller with integrated physical layer (PHY) SDHC MMC/SD/SDIO card host controller PSC Programmable serial controller 2 I C inter-integrated circuit communication interfaces S/PDIF Serial audio interface CAN Controller area network BDLC J1850 interface VIU Video Input, ITU-656 compliant RTC On-Chip real-time clock Freescale Semiconductor, Inc., 2010-2012. All rights reserved.Table of Contents 1 Ordering Information .3 3.3.11 FEC . 57 2 Pin Assignments 5 3.3.12 USB ULPI . 59 2.1 516-TEPBGA Ball Map 5 3.3.13 On-Chip USB PHY 60 2.2 Pinout Listings .6 3.3.14 SDHC 60 3 Electrical and Thermal Characteristics 17 3.3.15 DIU 62 3.1 DC Electrical Characteristics 17 3.3.16 SPDIF 65 3.1.1 Absolute Maximum Ratings 17 3.3.17 CAN . 65 2 3.1.2 Recommended Operating Conditions 18 3.3.18 I C 65 3.1.3 DC Electrical Specifications 19 3.3.19 J1850 66 3.1.4 Electrostatic Discharge .22 3.3.20 PSC . 66 3.1.5 Power Dissipation .23 3.3.21 GPIOs and Timers 73 3.1.6 Thermal Characteristics .24 3.3.22 Fusebox 73 3.2 Oscillator and PLL Electrical Characteristics 25 3.3.23 IEEE 1149.1 (JTAG) . 74 3.2.1 System Oscillator Electrical Characteristics .26 3.3.24 VIU 76 3.2.2 RTC Oscillator Electrical Characteristics 26 4 System Design Information 76 3.2.3 System PLL Electrical Characteristics 26 4.1 Power Up/Down Sequencing 76 3.2.4 e300 Core PLL Electrical Characteristics .27 4.2 System and CPU Core AVDD Power Supply Filtering. 76 3.3 AC Electrical Characteristics .28 4.3 Connection Recommendations 77 3.3.1 Overview 28 4.4 Pull-Up/Pull-Down Resistor Requirements . 78 3.3.2 AC Operating Frequency Data 28 4.4.1 Pull-Down Resistor Requirements for TEST pin78 3.3.3 Resets 29 4.4.2 Pull-Up Requirements for the PCI Control Lines78 3.3.4 External Interrupts .32 4.5 JTAG 78 3.3.5 SDRAM (DDR) .32 4.5.1 TRST 78 3.3.6 PCI .34 4.5.2 e300 COP / BDM Interface 79 3.3.7 LPC 36 5 Package Information . 82 3.3.8 NFC 43 5.1 Package Parameters 82 3.3.9 PATA 45 5.2 Mechanical Dimensions 83 3.3.10 SATA PHY .57 6 Product Documentation . 84 MPC5121E/MPC5123 Data Sheet, Rev. 5 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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