Freescale Semiconductor Document Number: MSC7119
Rev. 8, 4/2008
Data Sheet
MSC7119
Low-Cost 16-bit DSP with
MAP-BGA400
DDR Controller and 10/100
17 mm 17 mm
Mbps Ethernet MAC
StarCore SC1400 DSP extended core with one SC1400 DSP Multi-channel DMA controller with 32 time-multiplexed
core, 256 Kbyte of internal SRAM M1 memory, 16 way 16 Kbyte unidirectional channels, priority-based time-multiplexing
instruction cache (ICache), four-entry write buffer, programmable between channels using 32 internal priority levels, fixed- or
interrupt controller (PIC), and low-power Wait and Stop round-robin-priority operation, major-minor loop structure, and
processing modes. DONE or DRACK protocol from requesting units.
192 Kbyte M2 memory for critical data and temporary data Two independent TDM modules with independent receive and
buffering. transmit, programmable sharing of frame sync and clock,
8 Kbyte boot ROM. programmable word size (8 or 16-bit), hardware-base
AHB-Lite crossbar switch that allows parallel data transfers A-law/-law conversion, up to 50 Mbps data rate per TDM, up to
between four master ports and six slave ports, where each port 128 channels, with glueless interface to E1/T1 frames and MVIP,
connects to an AHB-Lite bus; fixed or round robin priority SCAS, and H.110 buses.
programmable at each slave port; programmable bus parking at Ethernet controller with support for 10/100 Mbps MII/RMII
each slave port; low power mode. designed to comply with IEEE Std. 802.3, 802.3u, 802.3x,
Internal PLL generates up to 300 MHz clock for the SC1400 core and 802.3ac; with internal receive and transmit FIFOs and a
and up to 150 MHz for the crossbar switch, DMA channels, M2 FIFO controller; direct access to internal memories via its own
memory, and other peripherals. DMA controller; full and half duplex operation; programmable
Clock synthesis module provides predivision of PLL input clock; maximum frame length; virtual local area network (VLAN) tag
independent clocking of the internal timers and DDR module; and priority support; retransmission of transmit FIFO following
programmable operation in the SC1400 low power Stop mode; collision; CRC generation and verification for inbound and
independent shutdown of different regions of the device. outbound packets; and address recognition including
Enhanced 16-bit wide host interface (HDI16) provides a glueless promiscuous, broadcast, individual address. hash/exact match,
connection to industry-standard microcomputers, and multicast hash match.
microprocessors, and DSPs and can also operate with an 8-bit host UART with full-duplex operation up to 5.0 Mbps.
data bus, making if fully compatible with the DSP56300 HI08 Up to 41 general-purpose input/output (GPIO) ports.
2
from the external host side. I C interface that allows booting from EEPROM devices up to 1
DDR memory controller that supports byte enables for up to a Mbyte.
32-bit data bus; glueless interface to 150 MHz 14-bit page mode Two quad timer modules, each with sixteen configurable 16-bit
DDR-RAM; 14-bit external address bus supporting up to 1 Gbyte; timers.
and 16-bit or 32-bit external data bus. fieldBIST unit detects and provides visibility into unlikely field
Programmable memory interface with independent read buffers, failures for systems with high availability to ensure structural
programmable predictive read feature for each buffer, and a write integrity, that the device operates at the rated speed, is free from
buffer. reliability defects, and reports diagnostics for partial or complete
System control unit performs software watchdog timer function; device inoperability.
includes programmable bus time-out monitors on AHB-Lite slave Standard JTAG interface allows easy integration to system
buses; includes bus error detection and programmable time-out firmware and internal on-chip emulation (OCE10) module.
monitors on AHB-Lite master buses; and has address Optional booting external host via 8-bit or 16-bit access through
2
out-of-range detection on each crossbar switch buses. the HDI16, I C, or SPI using in the boot ROM to access serial SPI
Event port collects and counts important signal events including Flash/EEPROM devices; different clocking options during boot
DMA and interrupt requests and trigger events such as interrupts, with the PLL on or off using a variety of input frequency ranges.
breakpoints, DMA transfers, or wake-up events; units operate
independently, in sequence, or triggered externally; can be used
standalone or with the OCE10.
Freescale Semiconductor, Inc., 2004, 2008. All rights reserved.
Table of Contents
1 Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Figure 8. TDM Receive Signals. . . . . . . . . . . . . . . . . . . . . . . . . 28
1.1 MAP-BGA Ball Layout Diagrams . . . . . . . . . . . . . . . . . .4 Figure 9. TDM Transmit Signals . . . . . . . . . . . . . . . . . . . . . . . . 29
1.2 Signal List By Ball Location. . . . . . . . . . . . . . . . . . . . . . .6 Figure 10. Ethernet Receive Signal Timing . . . . . . . . . . . . . . . . . 29
2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Figure 11. Ethernet Receive Signal Timing . . . . . . . . . . . . . . . . . 30
2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Figure 12. Asynchronous Input Signal Timing. . . . . . . . . . . . . . . 30
2.2 Recommended Operating Conditions. . . . . . . . . . . . . .18 Figure 13. Serial Management Channel Timing . . . . . . . . . . . . . 31
2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .19 Figure 14. Read Timing Diagram, Single Data Strobe . . . . . . . . 33
2.4 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . .19 Figure 15. Read Timing Diagram, Double Data Strobe. . . . . . . . 33
2.5 AC Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Figure 16. Write Timing Diagram, Single Data Strobe. . . . . . . . . 34
3 Hardware Design Considerations. . . . . . . . . . . . . . . . . . . . . .41 Figure 17. Write Timing Diagram, Double Data Strobe . . . . . . . . 34
3.1 Thermal Design Considerations . . . . . . . . . . . . . . . . . .41 Figure 18. Host DMA Read Timing Diagram, HPCR[OAD] = 0 . . 35
3.2 Power Supply Design Considerations. . . . . . . . . . . . . .42 Figure 19. Host DMA Write Timing Diagram, HPCR[OAD] = 0 . . 35
3.3 Estimated Power Usage Calculations. . . . . . . . . . . . . .49 Figure 20. I2C Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.4 Reset and Boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Figure 21. UART Input Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.5 DDR Memory System Guidelines . . . . . . . . . . . . . . . . .54 Figure 22. UART Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . 37
4 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Figure 23. EE Pin Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Figure 24. EVNT Pin Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6 Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Figure 25. GPI/GPO Pin Timing . . . . . . . . . . . . . . . . . . . . . . . . . 38
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 26. Test Clock Input Timing Diagram . . . . . . . . . . . . . . . . 39
Figure 27. Boundary Scan (JTAG) Timing Diagram . . . . . . . . . . 40
List of Figures
Figure 28. Test Access Port Timing Diagram . . . . . . . . . . . . . . . 40
Figure 1. MSC7119 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . 3
Figure 29. TRST Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 2. MSC7119 Molded Array Process-Ball Grid Array
Figure 30. Voltage Sequencing Case 1 . . . . . . . . . . . . . . . . . . . . 43
(MAP-BGA), Top View . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 31. Voltage Sequencing Case 2 . . . . . . . . . . . . . . . . . . . . 44
Figure 3. MSC7119 Molded Array Process-Ball Grid Array
Figure 32. Voltage Sequencing Case 3 . . . . . . . . . . . . . . . . . . . . 45
(MAP-BGA), Bottom View . . . . . . . . . . . . . . . . . . . . . . 5
Figure 33. Voltage Sequencing Case 4 . . . . . . . . . . . . . . . . . . . . 46
Figure 4. Timing Diagram for a Reset Configuration Write . . . . 25
Figure 34. Voltage Sequencing Case 5 . . . . . . . . . . . . . . . . . . . . 47
Figure 5. DDR DRAM Input Timing Diagram . . . . . . . . . . . . . . 26
Figure 35. PLL Power Supply Filter Circuits . . . . . . . . . . . . . . . . 48
Figure 6. DDR DRAM Output Timing Diagram . . . . . . . . . . . . . 27
Figure 36. SSTL Termination Techniques . . . . . . . . . . . . . . . . . . 54
Figure 7. DDR DRAM AC Test Load. . . . . . . . . . . . . . . . . . . . . 28
Figure 37. SSTL Power Value . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
MSC7119 Data Sheet, Rev. 8
2 Freescale Semiconductor