NVT4557HKX NXP

NVT4557 SIM card interface level translator with EMI filter and ESD protection Rev. 2.1 12 November 2021 Product data sheet 1 General description The NVT4557 device is built for interfacing a SIM card with a single low-voltage 1.08 V to 1.98 V host side interface. The NVT4557 contains three 1.62 V to 3.6 V level translators to convert the data, RSTn and CLKn signals between a SIM card and a host microcontroller. The NVT4557 is compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart card interface requirements. 2 Features and benefits Supports clock speed up to 10 MHz clock Compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart card interface requirements Support SIM card supply voltages with range of 1.62 V to 3.6 V Host microcontroller operating voltage range: 1.08 V to 1.98 V Automatic level translation of I/O, RSTn and CLKn between SIM card and host side interface with capacitance isolation Incorporates shutdown feature for the SIM card signals according to ISO-7816-3 Automatic enable and disable through V (Enable pin on NVT4557HK 10 pin CCB package only) Integrated pull-up and pull-down resistors: no external resistors required Integrated EMI filters suppress higher harmonics of digital I/Os Integrated 8 kV ESD protection according to IEC 61000-4-2, level 4 on V or any of CCB the card side pins. External ESD diodes are not required. Level shifting buffers keep ESD stress away from the host (zero-clamping concept) Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) Available in 9-pin WLCSP package in 0.3 mm pitch and 10-pin XQFN10 package with 0.4 mm pitch 3 Applications NVT4557 can be used with a range of SIM card attached devices including: Mobile and personal phones Wireless modems SIM card terminalsNXP Semiconductors NVT4557 SIM card interface level translator with EMI filter and ESD protection 4 Ordering information Table 1.Ordering information Type number Topside Package mark Name Description Version NVT4557UK 7 WLCSP9 wafer level CSP package 9 bumps (3 x 3) body SOT2042-2 0.92 mm 0.92 mm 0.525 mm with 0.3 mm pitch NVT4557HK 57 XQFN10 plastic, extremely thin quad flat package no SOT1160-1 leads 10 terminals body 1.40 x 1.80 x 0.50 mm Table 2.Ordering options Type number Orderable part Package Packing method Minimum order Temperature number quantity 1 WLCSP9 NVT4557UK NVT4557UKAZ Reel 13 Q1/T1 DP 20000 T = -40 C to +85 C amb 2 NVT4557HK NVT4557HKX XQFN10 Reel 7 Q1/T1 NDP 4000 T = -40 C to +85 C amb 1 Find packing information - www.nxp.com/docs/en/packing/SOT2042-2 118.pdf 2 Find packing information - www.nxp.com/docs/en/packing/SOT1160-1 115.pdf 5 Functional diagram V V CCA CCB R1 RST HOST RST SIM R1 CLK HOST CLK SIM R1 IO HOST IO SIM CONTROL (1) EN LOGIC GND aaa-037133 1. 10-pin version only Figure 1.Functional diagram NVT4557 All information provided in this document is subject to legal disclaimers. NXP B.V. 2021. All rights reserved. Product data sheet Rev. 2.1 12 November 2021 2 / 28