PK10FN1M0VMD12 NXP

Document Number K10P144M120SF3 Freescale Semiconductor Rev. 6, 09/2015 Data Sheet: Technical Data K10P144M120SF3 K10 Sub-Family Supports the following: MK10FX512VLQ12, MK10FN1M0VLQ12, MK10FX512VMD12, MK10FN1M0VMD12 Key features Security and integrity modules Hardware CRC module to support fast cyclic Operating Characteristics redundancy checks Voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per Flash write voltage range: 1.71 to 3.6 V chip Temperature range (ambient): -40 to 105C Human-machine interface Performance Low-power hardware touch sensor interface Up to 120 MHz ARM Cortex-M4 core with (TSI) DSP instructions delivering 1.25 Dhrystone General-purpose input/output MIPS per MHz Analog modules Memories and memory interfaces Four 16-bit SAR ADCs Up to 1024 KB program flash memory on non- Programmable gain amplifier (PGA) (up to x64) FlexMemory devices integrated into each ADC Up to 512 KB program flash memory on Two 12-bit DACs FlexMemory devices Four analog comparators (CMP) containing a 6- Up to 512 KB FlexNVM on FlexMemory devices bit DAC and programmable reference input 16 KB FlexRAM on FlexMemory devices Voltage reference Up to 128 KB RAM Serial programming interface (EzPort) Timers FlexBus external bus interface Programmable delay block NAND flash controller interface Two 8-channel motor control/general purpose/PWM timers Clocks Two 2-channel quadrature decoder/general 3 to 32 MHz crystal oscillator purpose timers 32 kHz crystal oscillator Periodic interrupt timers Multi-purpose clock generator 16-bit low-power timer System peripherals Carrier modulator transmitter Multiple low-power modes to provide power Real-time clock optimization based on application requirements Communication interfaces Memory protection unit with multi-master Two Controller Area Network (CAN) modules protection Three SPI modules 32-channel DMA controller, supporting up to Two I2C modules 128 request sources Six UART modules External watchdog monitor Secure Digital Host Controller (SDHC) Software watchdog Two I2S modules Low-leakage wakeup unit Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122015 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts........................................................................... 3 6.1.1 Debug trace timing specifications......................... 21 1.1 Determining valid orderable parts......................................3 6.1.2 JTAG electricals....................................................22 2 Part identification...................................................................... 3 6.2 System modules................................................................25 2.1 Description.........................................................................3 6.3 Clock modules...................................................................25 2.2 Format............................................................................... 3 6.3.1 MCG specifications............................................... 25 2.3 Fields.................................................................................3 6.3.2 Oscillator electrical specifications......................... 27 2.4 Example............................................................................ 4 6.3.3 32 kHz oscillator electrical characteristics.............29 3 Terminology and guidelines...................................................... 4 6.4 Memories and memory interfaces..................................... 30 3.1 Definitions..........................................................................4 6.4.1 Flash (FTFE) electrical specifications................... 30 3.2 Examples...........................................................................4 6.4.2 EzPort switching specifications.............................34 3.3 Typical-value conditions.................................................... 5 6.4.3 NFC specifications................................................ 35 3.4 Relationship between ratings and operating 6.4.4 Flexbus switching specifications........................... 38 requirements......................................................................5 6.5 Security and integrity modules.......................................... 41 3.5 Guidelines for ratings and operating requirements............6 6.6 Analog............................................................................... 41 4 Ratings......................................................................................6 6.6.1 ADC electrical specifications.................................41 4.1 Thermal handling ratings...................................................6 6.6.2 CMP and 6-bit DAC electrical specifications.........49 4.2 Moisture handling ratings.................................................. 7 6.6.3 12-bit DAC electrical characteristics..................... 51 4.3 ESD handling ratings.........................................................7 6.6.4 Voltage reference electrical specifications............54 4.4 Voltage and current operating ratings............................... 7 6.7 Timers................................................................................55 5 General..................................................................................... 7 6.8 Communication interfaces.................................................55 5.1 AC electrical characteristics.............................................. 8 6.8.1 CAN switching specifications................................ 55 5.2 Nonswitching electrical specifications............................... 8 6.8.2 DSPI switching specifications (limited voltage 5.2.1 Voltage and current operating requirements.........8 range)....................................................................56 5.2.2 LVD and POR operating requirements................. 9 6.8.3 DSPI switching specifications (full voltage range).57 5.2.3 Voltage and current operating behaviors.............. 10 6.8.4 Inter-Integrated Circuit Interface (I2C) timing........59 5.2.4 Power mode transition operating behaviors..........12 6.8.5 UART switching specifications..............................60 5.2.5 Power consumption operating behaviors..............13 6.8.6 SDHC specifications............................................. 60 5.2.6 EMC radiated emissions operating behaviors.......16 6.8.7 I2S/SAI switching specifications............................61 5.2.7 Designing with radiated emissions in mind........... 17 6.9 Human-machine interfaces (HMI)......................................68 5.2.8 Capacitance attributes.......................................... 17 6.9.1 TSI electrical specifications...................................68 5.3 Switching specifications.....................................................17 7 Dimensions............................................................................... 69 5.3.1 Device clock specifications................................... 17 7.1 Obtaining package dimensions......................................... 69 5.3.2 General switching specifications...........................18 8 Pinout........................................................................................69 5.4 Thermal specifications.......................................................19 8.1 Pins with active pull control after reset.............................. 69 5.4.1 Thermal operating requirements...........................19 8.2 K10 Signal Multiplexing and Pin Assignments.................. 70 5.4.2 Thermal attributes................................................. 20 8.3 K10 pinouts....................................................................... 76 6 Peripheral operating requirements and behaviors.................... 21 9 Revision History........................................................................ 78 6.1 Core modules.................................................................... 21 K10 Sub-Family, Rev.6, 09/2015. 2 Freescale Semiconductor, Inc.