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This literature is subject to all applicable copyright laws and is not for resale in any manner.74ALVC162244 Low Voltage 16-Bit Buffer/Line Driver with 3.6V Tolerant Inputs and Outputs and 26 Series Resistor in Outputs November 2001 Revised November 2001 74ALVC162244 Low Voltage 16-Bit Buffer/Line Driver with 3.6V Tolerant Inputs and Outputs and 26 Series Resistor in Outputs General Description The ALVC162244 contains sixteen non-inverting buffers Features with 3-STATE outputs to be employed as a memory and address driver, clock driver, or bus oriented transmitter/ 1.65V to 3.6V V supply operation CC receiver. The device is nibble (4-bit) controlled. Each nibble 3.6V tolerant inputs and outputs has separate 3-STATE control inputs which can be shorted 26 series resistors in outputs together for full 16-bit operation. t PD The 74ALVC162244 is designed for low voltage (1.65V to 3.8 ns max for 3.0V to 3.6V V 3.6V) V applications with I/O capability up to 3.6V. The CC CC 74ALVC162244 is also designed with 26 series resistors 4.3 ns max for 2.3V to 2.7V V CC in the outputs. This design reduces line noise in applica- 7.6 ns max for 1.65V to 1.95V V CC tions such as memory address drivers, clock drivers, and bus transceivers/transmitters. Power-off high impedance inputs and outputs Supports live insertion and withdrawal The 74ALVC162244 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- Uses patented noise/EMI reduction circuitry ing low CMOS power dissipation. Latchup conforms to JEDEC JED78 ESD performance: Human body model > 2000V Machine model > 200V Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Note 1: To ensure the high-impedance state during power up or power down, OE should be tied to V through a pull-up resistor the minimum CC value of the resistor is determined by the current-sourcing capability of the driver. Ordering Code: Order Number Package Number Package Description 74ALVC162244GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 2) TAPE and REEL 74ALVC162244T MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 3) Note 2: BGA package available in Tape and Reel only. Note 3: Devices also available in Tape and Reel. Specify by appending suffix letter X to the ordering code. 2001 Fairchild Semiconductor Corporation DS500696 www.fairchildsemi.com