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Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.74LCX07 Low Voltage Hex Buffer with Open Drain Outputs December 2013 74LCX07 Low Voltage Hex Buffer with Open Drain Outputs Features General Description 5V tolerant inputs The LCX07 contains six buffers. The inputs tolerate volt- ages up to 7V allowing the interface of 5V systems to 3V 2.3V to 5.5V V specifications provided CC systems. 2.9ns t max. (V = 3.3V), 10A I max. PD CC CC The outputs of the LCX07 are open drain and can be Power down high impedance inputs and outputs connected to other open drain outputs to implement +24mA output drive (V = 3.0V) CC active HIGH wire AND or active LOW wire OR functions. Implements proprietary noise/EMI reduction circuitry The 74LCX07 is fabricated with advanced CMOS tech- Latch-up performance exceeds JEDEC 78 conditions nology to achieve high speed operation while maintain- ESD performance: ing CMOS low power dissipation. Human body model > 2000V Machine model > 200V Leadless DQFN package Ordering Information Package Order Number Number Package Description 74LCX07M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow 74LCX07SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide (1) 74LCX07BQX MLP14A 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 74LCX07MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Note: 1. DQFN package available in Tape and Reel only. Device also available in Tape and Reel. Specify by appending suffix letter X to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX07 Rev. 1.11.1