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This literature is subject to all applicable copyright laws and is not for resale in any manner.74LCX541 Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs December 2013 74LCX541 Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Features General Description 5V tolerant input and outputs The LCX541 is an octal buffer/line driver designed to be employed as memory and address drivers, clock drivers 2.3V3.6V V specifications provided CC and bus oriented transmitter/receivers. The LCX541 is a 6.5ns t max (V = 3.3V), 10A I max PD CC CC non inverting option of the LCX540. Power-down high impedance inputs and outputs (1) This device is similar in function to the LCX244 while Supports live insertion/withdrawal providing flow-through architecture (inputs on opposite 24 mA output drive (V = 3.0V) CC side from outputs). This pinout arrangement makes this Implements proprietary noise/ EMI reduction circuitry device especially useful as an output port for micropro- Latch-up performance exceeds JEDEC 78 conditions cessors, allowing ease of layout and greater PC board density. ESD performance Human body model > 2000V The LCX541 is designed for low voltage applications Machine model > 200V with capability of interfacing to a 5V signal environment. The LCX541 is fabricated with an advanced CMOS Leadless DQFN package technology to achieve high speed operation while maintaining CMOS low power dissipation. Note: 1. To ensure the high impedance state during power up or down, OE should be tied to V through a pull-up CC resistor: the minimum value of the resistor is determined by the current-sourcing capability of the driver. Ordering Information Package Order Number Number Package Description 74LCX541WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LCX541SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide (2) MLP20B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), 74LCX541BQX JEDEC MO-241, 2.5 x 4.5mm 74LCX541MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LCX541MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Note: 2. DQFN package available in Tape and Reel only. Device also available in Tape and Reel. Specify by appending suffix letter X to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX541 Rev. 1.6.1