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This literature is subject to all applicable copyright laws and is not for resale in any manner.74LCXR2245 Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26 Series Resistors on Both A and B Ports March 2008 74LCXR2245 Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs and 26 Series Resistors on Both A and B Ports Features General Description 5V tolerant inputs and outputs The LCXR2245 contains eight non-inverting bidirectional buffers with 3-STATE outputs and is intended for bus ori- 2.3V3.6V V specifications provided CC ented applications. The device is designed for low volt- 8.0ns t max. (V = 3.3V), 10A I max. PD CC CC age (2.5V and 3.3V) V applications with capability of CC Power down high impedance inputs and outputs interfacing to a 5V signal environment. The T/R input (1) Supports live insertion/withdrawal determines the direction of data flow through the device. 12mA output drive (V = 3.0V) The OE input disables both the A and B ports by placing CC them in a high impedance state. The 26 series resistor Implements proprietary noise/EMI reduction circuitry helps reduce output overshoot and undershoot. Latch-up performance exceeds 500mA Equivalent 26 series resistor on all outputs The LCXR2245 is fabricated with an advanced CMOS technology to achieve high speed operation while main- ESD performance: taining CMOS low power dissipation. Human body model > 2000V Machine model > 200V Note: 1. To ensure the high-impedance state during power up or down, OE should be tied to V through a pull-up CC resistor: the minimum value or the resistor is determined by the current-sourcing capability of the driver. Ordering Information Package Order Number Number Package Description 74LCXR2245WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LCXR2245SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LCXR2245MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LCXR2245MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter X to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. 2000 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCXR2245 Rev. 1.2.0