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This literature is subject to all applicable copyright laws and is not for resale in any manner.74LVT245, 74LVTH245 Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs February 2008 74LVT245, 74LVTH245 Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs Features General Description Input and output interface capability to systems at The LVT245 and LVTH245 contain eight non-inverting 5V V bidirectional buffers with 3-STATE outputs and are CC intended for bus-oriented applications. The Transmit/ Bushold data inputs eliminate the need for external Receive (T/R) input determines the direction of data flow pull-up resistors to hold unused inputs (74LVTH245), through the bidirectional transceiver. Transmit (active- also available without bushold feature (74LVT245) HIGH) enables data from A ports to B ports Receive Live insertion/extraction permitted (active-LOW) enables data from B ports to A ports. The Power Up/Down high impedance provides glitch-free Output Enable input, when HIGH, disables both A and B bus loading ports by placing them in a HIGH Z condition. Outputs source/sink, 32mA/+64mA The LVTH245 data inputs include bushold, eliminating Latch-up performance exceeds 500mA the need for external pull-up resistors to hold unused ESD performance: inputs. Human-body model > 2000V These transceivers are designed for low-voltage (3.3V) Machine model > 200V V applications, but with the capability to provide a TTL CC Charged-device model > 1000V interface to a 5V environment. The LVT245 and LVTH245 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining a low power dissipation. Ordering Information Package Order Number Number Package Description 74LVT245WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVT245SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVT245MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LVT245MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LVTH245WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVTH245SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVTH245MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LVTH245MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter X to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LVT245, 74LVTH245 Rev. 1.4.0