MC74AC08DTR2G ON Semiconductor

MC74AC08, MC74ACT08 Quad 2-Input AND Gate HighPerformance SiliconGate CMOS Features Outputs Source/Sink 24 mA www.onsemi.com ACT08 Has TTL Compatible Inputs These are PbFree Devices MARKING DIAGRAMS 14 V CC SOIC14 14 13 12 11 10 9 8 xxx08G D SUFFIX AWLYWW CASE 751A 14 1 1 14 1 2 345 67 xxx TSSOP14 08 GND DT SUFFIX ALYW 1 Figure 1. Pinout: 14Lead Packages Conductors CASE 948G (Top View) 14 1 xxx = AC or ACT A = Assembly Location WL or L = Wafer Lot Y = Year WW or W = Work Week G or = PbFree Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: January, 2015 Rev. 10 MC74AC08/DMC74AC08, MC74ACT08 MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage 0.5 to 7.0 V CC V DC Input Voltage 0.5 V V 0.5 V I I CC V DC Output Voltage (Note 1) 0.5 V V 0.5 V O O CC I DC Input Diode Current 20 mA IK I DC Output Diode Current 50 mA OK I DC Output Sink/Source Current 50 mA O I DC Supply Current per Output Pin 50 mA CC I DC Ground Current per Output Pin 50 mA GND T Storage Temperature Range 65 to 150 C STG T Lead temperature, 1 mm from Case for 10 Seconds 260 C L T Junction temperature under Bias 150 C J Thermal Resistance (Note 2) SOIC 125 C/W JA TSSOP 170 P Power Dissipation in Still Air at 85C SOIC 125 mW D TSSOP 170 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 30% 35% UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Model (Note 3) > 2000 V ESD Machine Model (Note 4) > 200 Charged Device Model (Note 5) > 1000 I LatchUp Performance Above V and Below GND at 85C (Note 6) 100 mA LatchUp CC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. I absolute maximum rating must be observed. O 2. The package thermal impedance is calculated in accordance with JESD517. 3. Tested to EIA/JESD22A114A. 4. Tested to EIA/JESD22A115A. 5. Tested to JESD22C101A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit AC 2.0 5.0 6.0 V Supply Voltage V CC ACT 4.5 5.0 5.5 V , V DC Input Voltage, Output Voltage (Ref. to GND) 0 V V in out CC V 3.0 V 150 ns/V CC Input Rise and Fall Time (Note 1) V 4.5 V 40 t , t r f CC AC Devices except Schmitt Inputs V 5.5 V 25 CC V 4.5 V 10 Input Rise and Fall Time (Note 2) CC t , t ns/V r f ACT Devices except Schmitt Inputs V 5.5 V 8.0 CC T Junction Temperature (PDIP) 140 C J T Operating Ambient Temperature Range 40 25 85 C A I Output Current High 24 mA OH I Output Current Low 24 mA OL Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. V from 30% to 70% V see individual Data Sheets for devices that differ from the typical input rise and fall times. in CC 2. V from 0.8 V to 2.0 V see individual Data Sheets for devices that differ from the typical input rise and fall times. in www.onsemi.com 2