MC74AC125DG ON Semiconductor

MC74AC125, MC74ACT125 Quad 3-state Buffer with Low Enable HighPerformance SiliconGate CMOS www.onsemi.com Features Outputs Source/Sink MARKING ACT125 Has TTL Compatible Inputs DIAGRAMS These are PbFree Devices 14 SOIC14 xxx125G D SUFFIX AWLYWW CASE 751A 14 V A B O A B O CC 2 2 2 3 3 3 1 14 13 12 11 10 9 8 1 14 xxx TSSOP14 125 DT SUFFIX ALYW 1 CASE 948G 1 2 3456 7 14 A B O A B O GND 0 0 0 1 1 1 1 Figure 1. Pinout: 14Lead Packages Conductors xxx = AC or ACT (Top View) A = Assembly Location WL or L = Wafer Lot Y = Year WW or W = Work Week PIN ASSIGNMENT G or = PbFree Package (Note: Microdot may be in either location) PIN FUNCTION A , B Inputs n n O Outputs n ORDERING INFORMATION See detailed ordering and shipping information in the package FUNCTION TABLE dimensions section on page 5 of this data sheet. Inputs Output A B O n n n L L L L H H H X Z NOTE: H = High Voltage Level L = Low Voltage Level Z = High Impedance X = Immaterial Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: January, 2015 Rev. 8 MC74AC125/DMC74AC125, MC74ACT125 MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage 0.5 to 7.0 V CC V DC Input Voltage 0.5 V V 0.5 V I I CC V DC Output Voltage (Note 1) 0.5 V V 0.5 V O O CC I DC Input Diode Current 20 mA IK I DC Output Diode Current 50 mA OK I DC Output Sink/Source Current 50 mA O I DC Supply Current per Output Pin 50 mA CC I DC Ground Current per Output Pin 50 mA GND T Storage Temperature Range 65 to 150 C STG T Lead temperature, 1 mm from Case for 10 Seconds 260 C L T Junction temperature under Bias 150 C J Thermal Resistance (Note 2) SOIC 125 C/W JA TSSOP 170 P Power Dissipation in Still Air at 85C SOIC 125 mW D TSSOP 170 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 30% 35% UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Model (Note 3) > 2000 V ESD Machine Model (Note 4) > 200 Charged Device Model (Note 5) > 1000 I LatchUp Performance Above V and Below GND at 85C (Note 6) 100 mA LatchUp CC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. I absolute maximum rating must be observed. O 2. The package thermal impedance is calculated in accordance with JESD517. 3. Tested to EIA/JESD22A114A. 4. Tested to EIA/JESD22A115A. 5. Tested to JESD22C101A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit AC 2.0 5.0 6.0 V Supply Voltage V CC ACT 4.5 5.0 5.5 V , V DC Input Voltage, Output Voltage (Ref. to GND) 0 V V in out CC V 3.0 V 150 CC Input Rise and Fall Time (Note 1) V 4.5 V 40 ns/V t , t r f CC AC Devices except Schmitt Inputs V 5.5 V 25 CC T Junction Temperature (PDIP) 140 C J T Operating Ambient Temperature Range 40 25 85 C A I Output Current HIGH 24 mA OH I Output Current LOW 24 mA OL Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. V from 30% to 70% V see individual Data Sheets for devices that differ from the typical input rise and fall times. in CC 2. V from 0.8 V to 2.0 V see individual Data Sheets for devices that differ from the typical input rise and fall times. in www.onsemi.com 2