MC74AC240, MC74ACT240 Octal Buffer/Line Driver with 3-State Outputs The MC74AC240/74ACT240 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter or receiver which provides improved PC www.onsemi.com board density. Features SOIC20W 3State Outputs Drive Bus Lines or Buffer Memory Address DW SUFFIX Registers CASE 751D Outputs Source/Sink 24 mA 1 ACT240 Has TTL Compatible Inputs These are PbFree Devices TSSOP20 TRUTH TABLE DT SUFFIX CASE 948E Inputs Outputs 1 OE D (Pins 12, 14, 16, 18) 1 L L H L H L ORDERING INFORMATION H X Z See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. NOTE: H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial DEVICE MARKING INFORMATION Z = High Impedance See general marking information in the device marking section on page 7 of this data sheet. TRUTH TABLE Inputs Outputs OE D (Pins 3, 5, 7, 9) 2 L L H L H L H X Z NOTE: H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance V OE CC 2 20 19 18 17 16 15 14 13 12 11 1 2 34567 8 9 10 OE GND 1 Figure 1. Pinout: 20Lead Packages Conductors (Top View) Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: February, 2015 Rev. 9 MC74AC240/DMC74AC240, MC74ACT240 MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V CC V DC Input Voltage (Referenced to GND) 0.5 to V +0.5 V IN CC V DC Output Voltage (Referenced to GND) (Note 1) 0.5 to V +0.5 V OUT CC I DC Input Diode Current 20 mA IK I DC Output Diode Current 50 mA OK I DC Output Sink/Source Current 50 mA OUT I DC Supply Current, per Output Pin 50 mA CC I DC Ground Current, per Output Pin 100 mA GND T Storage Temperature Range 65 to 150 C STG T Lead temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias 140 C J Thermal Resistance (Note 2) SOIC 65.8 C/W JA TSSOP 110.7 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 30% 35% UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Model (Note 3) > 2000 V ESD Machine Model (Note 4) > 200 Charged Device Model (Note 5) > 1000 I Latchup Performance Above V and Below GND at 85 C (Note 6) 100 mA Latchup CC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. I absolute maximum rating must be observed. O 2. The package thermal impedance is calculated in accordance with JESD 517. 3. Tested to EIA/JESD22A114A. 4. Tested to EIA/JESD22A115A. 5. Tested to JESD22C101A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit AC 2.0 5.0 6.0 V Supply Voltage V CC ACT 4.5 5.0 5.5 V , V DC Input Voltage, Output Voltage (Ref. to GND) 0 V V IN OUT CC V 3.0 V 150 CC Input Rise and Fall Time (Note 7) t , t V 4.5 V 40 ns/V r f CC AC Devices except Schmitt Inputs V 5.5 V 25 CC V 4.5 V 10 CC Input Rise and Fall Time (Note 8) t , t ns/V r f ACT Devices except Schmitt Inputs V 5.5 V 8.0 CC T Operating Ambient Temperature Range 40 25 85 C A I Output Current High 24 mA OH I Output Current Low 24 mA OL Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 7. V from 30% to 70% V see individual Data Sheets for devices that differ from the typical input rise and fall times. IN CC 8. V from 0.8 V to 2.0 V see individual Data Sheets for devices that differ from the typical input rise and fall times. IN www.onsemi.com 2