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This literature is subject to all applicable copyright laws and is not for resale in any manner.MM74HCT373 MM74HCT374 3-STATE Octal D-Type Latch 3-STATE Octal D-Type Flip-Flop February 1984 Revised May 2005 MM74HCT373 MM74HCT374 3-STATE Octal D-Type Latch 3-STATE Octal D-Type Flip-Flop General Description Features The MM74HCT373 octal D-type latches and TTL input characteristic compatible MM74HCT374 Octal D-type flip flops advanced silicon-gate Typical propagation delay: 20 ns CMOS technology, which provides the inherent benefits of Low input current: 1 PA maximum low power consumption and wide power supply range, but Low quiescent current: 80 PA maximum are LS-TTL input and output characteristic & pin-out com- patible. The 3-STATE outputs are capable of driving 15 LS- Compatible with bus-oriented systems TTL loads. All inputs are protected from damage due to Output drive capability: 15 LS-TTL loads static discharge by internal diodes to V and ground. CC When the MM74HCT373 LATCH ENABLE input is HIGH, the Q outputs will follow the D inputs. When the LATCH ENABLE goes LOW, data at the D inputs will be retained at the outputs until LATCH ENABLE returns HIGH again. When a high logic level is applied to the OUTPUT CON- TROL input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the storage elements. The MM74HCT374 are positive edge triggered flip-flops. Data at the D inputs, meeting the setup and hold time requirements, are transferred to the Q outputs on positive going transitions of the CLOCK (CK) input. When a high logic level is applied to the OUTPUT CONTROL (OC) input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the storage elements. MM74HCT devices are intended to interface between TTL and NMOS components and standard CMOS devices. These parts are also plug in replacements for LS-TTL devices and can be used to reduce power consumption in existing designs. Ordering Code: Order Number Package Number Package Descriptions MM74HCT373WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide MM74HCT373SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT373MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT373N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide MM74HCT374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide MM74HCT374SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT374N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide Devices also available in Tape and Reel. Specify by appending the suffix letter X to the ordering code. 2005 Fairchild Semiconductor Corporation DS005367 www.fairchildsemi.com