MMSZ52xxxT1G Series,
SZMMSZ52xxxT1G Series
Zener Voltage Regulators
500 mW SOD123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
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surface mount plastic SOD123 package. These devices provide a
convenient alternative to the leadless 34package style. Zener voltage
in this series are specified with device junction in thermal equilibrium.
Features
500 mW Rating on FR4 or FR5 Board
SOD123
Wide Zener Reverse Voltage Range 2.4 V to 110 V @ Thermal
CASE 425
STYLE 1
Equilibrium*
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
1 2
General Purpose, Medium Current
Cathode Anode
ESD Rating of Class 3 (> 16 kV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
MARKING DIAGRAM
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
xx M
1
These are PbFree Devices*
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
xx = Device Code (Refer to page 3)
FINISH: Corrosion resistant finish, easily solderable
M = Date Code
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
= PbFree Package
260C for 10 Seconds
(Note: Microdot may be in either location)
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V0
ORDERING INFORMATION
Device Package Shipping
MAXIMUM RATINGS
MMSZ52xxBT1G, SOD123 3,000 /
Rating Symbol Max Units
SZMMSZ52xxBT1G (PbFree) Tape & Reel
Total Power Dissipation on FR5 Board, P
D
MMSZ52xxCT1G, SOD123 3,000 /
(Note 1) @ T = 75C 500 mW
L
SZMMSZ52xxCT1G
Derated above 75C 6.7 mW/C (PbFree) Tape & Reel
MMSZ52xxBT3G, SOD123 10,000 /
Thermal Resistance, JunctiontoAmbient R 340 C/W
JA
SZMMSZ52xxBT3G
(Note 2) (PbFree) Tape & Reel
MMSZ52xxCT3G, SOD123 10,000 /
Thermal Resistance, JunctiontoLead R 150 C/W
JL
SZMMSZ52xxCT3G
(Note 2) (PbFree) Tape & Reel
For information on tape and reel specifications,
Junction and Storage Temperature Range T , T 55 to +150 C
J stg
including part orientation and tape sizes, please
Stresses exceeding those listed in the Maximum Ratings table may damage the
refer to our Tape and Reel Packaging Specifications
device. If any of these limits are exceeded, device functionality should not be
Brochure, BRD8011/D.
assumed, damage may occur and reliability may be affected.
1. FR5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
*For additional info on thermal equilibrium, please download, ON Semiconductor
column of the Electrical Characteristics table on page 3 of
TVS/Zener Theory and Design Considerations Handbook, HBD854/D.
this data sheet.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2015
1 Publication Order Number:
March, 2015 Rev. 14 MMSZ5221BT1/DMMSZ52xxxT1G Series, SZMMSZ52xxxT1G Series
ELECTRICAL CHARACTERISTICS (T = 25C unless
A I
otherwise noted, V = 0.95 V Max. @ I = 10 mA)
F F
I
F
Symbol Parameter
V Reverse Zener Voltage @ I
Z ZT
I Reverse Current
ZT
V V
Z Maximum Zener Impedance @ I
Z R
ZT ZT
V
I
V
R
F
I Reverse Current
I
ZK
ZT
Z Maximum Zener Impedance @ I
ZK ZK
I Reverse Leakage Current @ V
R R
V Reverse Voltage
R
I Forward Current
F
V Forward Voltage @ I Zener Voltage Regulator
F F
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