NC7WV17L6X ON Semiconductor

DATA SHEET www.onsemi.com TinyLogic ULP-A Dual MARKING DIAGRAMS Buffer with Schmitt-Trigger SIP6 1.45X1.0 Input CCKK MicroPak XYZ CASE 127EB Pin 1 NC7WV17 The NC7WV17 is a dual buffer with Schmitttrigger input in tiny CC = Specific Device Code = footprint packages. The device is designed to operate for V 0.9 V KK = 2Digit Lot Run Traceability Code CC XY = 2Digit Date Code to 3.6 V. Z = Assembly Plant Code Features 6 Designed for 0.9 V to 3.6 V V Operation CC SC88 2.2 ns t at 3.3 V (Typ) PD XXXM DF SUFFIX Inputs/Outputs OverVoltage Tolerant up to 3.6 V CASE 419B02 I Supports Partial Power Down Protection OFF 1 1 Source/Sink 24 mA at 3.3 V XXX = Specific Devic Code Available in SC88A and MicroPak Packages M = Date Code These Devices are PbFree, Halogen Free/BFR Free and are RoHS = PbFree Package Compliant (Note: Microdot may be in either location) *Date Code orientation and/or position may vary A1 1 6Y1 depending upon manufacturing location. A1 1 6 Y1 GND 2 5 V GND 2 5V CC CC ORDERING INFORMATION See detailed ordering, marking and shipping information on A2 3 4 Y2 A2 3 4Y2 page 7 of this data sheet. MicroPak SC88A Figure 1. Pinout Diagrams (Top Views) 1 A1 Y1 1 A2 Y2 Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin Function Input Output 1 A1 L L 2 GND H H 3 A2 4 Y2 5 V CC 6 Y1 Semiconductor Components Industries, LLC, 2004 1 Publication Order Number: August, 2021 Rev. 3 NC7WV17/DNC7WV17 MAXIMUM RATINGS Symbol Characteristics Value Unit V DC Supply Voltage 0.5 to +4.3 V CC V DC Input Voltage 0.5 to +4.3 V IN V DC Output Voltage ActiveMode (High or Low State) 0.5 to V + 0.5 V OUT CC TriState Mode (Note 1) 0.5 to +4.3 PowerDown Mode (V = 0 V) 0.5 to +4.3 CC I DC Input Diode Current V < GND 50 mA IK IN I DC Output Diode Current V < GND 50 mA OK OUT I DC Output Source/Sink Current 50 mA OUT I or I DC Supply Current per Supply Pin or Ground Pin 50 mA CC GND T Storage Temperature Range 65 to +150 C STG T Lead Temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias +150 C J Thermal Resistance (Note 2) SC88A 377 C/W JA MicroPak 154 P Power Dissipation in Still Air SC88A 332 mW D MicroPak 812 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage (Note 3) Human Body Mode 2000 mW ESD Charged Device Mode 1000 I Latchup Performance (Note 4) 100 mA Latchup Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tristated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2 ounce copper trace no air flow per JESD517. 3. HBM tested to EIA / JESD22A114A. CDM tested to JESD22C101A. JEDEC recommends that ESD qualification to EIA/JESD22A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. www.onsemi.com 2