NLAS3157, NLAS3257 Low Voltage SPDT Mux / Demux Analog Switch The NLAS3157 Mux / Demux Analog Switch is an advanced high speed singlepole doublethrow (SPDT) CMOS switch. It can be used as an analog switch or as a lowdelay bus switch. Breakbeforemake www.onsemi.com switching prevents both switches being enabled simultaneously. This eliminates signal disruption during switching. The control input, S, is independent of supply voltage line switch in an ultrasmall footprint. MARKING DIAGRAMS Features ULLGA6 High Speed: t = 0.25 ns (Max) V = 4.5 V PD CC 1.0 x 1.0 M R : 8.5 Typ V = 4.2 V ON CC CASE 613AD C : 7.5 pF Typ V = 3.3 V ON CC Y = Specific Device Code V Range: 1.65 V to 4.5 V CC M = Date Code UltraSmall 1 x 1 mm Package XLLGA6 This Device is PbFree, Halogen Free/BFR Free and RoHS L M 1.0 x 1.0 Compliant CASE 713AD Typical Applications L = Specific Device Code Mobile Phones, PDAs, Camera M = Date Code V 1 6 S B1 1 6 S FUNCTION TABLE CC Input S Function GND 2 5 V B1 2 5 GND CC L A = B0 H A = B1 3 4 A34 B0 B0 A Figure 1. ULLGA6 Figure 2. XLLGA6 ORDERING INFORMATION See detailed ordering and shipping information on page 5 of (NLAS3157) (NLAS3257) this data sheet. (Top View) (Top View) A B0 B1 S Figure 3. Logic Diagram Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: May, 2018 Rev. 3 NLAS3157/D YNLAS3157, NLAS3257 Table 1. MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage 0.5 to +5.5 V CC V Control Input Voltage (S Pin) 0.5 to +5.5 V IN V Switch Input / Output Voltage (A, BO, B1 Pins) 0.5 to V + 0.5 V IS CC I Control DC Input Diode Current (S Pin) V < GND 50 mA IK IN I Switch I/O Port DC Diode Current (A, BO, B1 Pins) V < GND or V > V 50 mA OK I/O I/O CC I OnState Switch Current 128 mA O Continuous Current Through V or GND 150 mA CC I DC Supply Current per Supply Pin 150 mA CC I DC Ground Current per Ground Pin 150 mA GND T Storage Temperature Range 65 to +150 C STG T Lead Temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias 150 C J Thermal Resistance (Note 1) 407 C/W JA P Power Dissipation in Still Air at 85C (Note 1) 1.5 mW D MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Mode (Note 2) >8000 V ESD Machine Mode (Note 3) >300 Charged Device Mode (Note 4) >2000 I Latchup Performance Above V and Below GND at 85C (Note 5) 100 mA LATCHUP CC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/ JESD22A114A 3. Tested to EIA/ JESD22A115A 4. Tested to JESD22C101A 5. Tested to EIA / JESD78 Table 2. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V Positive DC Supply Voltage 1.65 4.5 V CC V Control Input Voltage (S Pin) 0 4.5 V I V Switch Input / Output Voltage (A, BO, B1 Pins) 0 V V IS CC T Operating FreeAir Temperature 40 +85 C A t / V Input Transition Rise or Fall Rate Control Input 0 5 ns/V Switch I/O 0 DC Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2