NTLJD3119C MOSFET Power, Complementary, WDFN 2X2 mm 20 V/-20 V, 4.6 A/-4.1 A www.onsemi.com Features Complementary NChannel and PChannel MOSFET WDFN Package with Exposed Drain Pad for Excellent Thermal V R MAX I MAX (BR)DSS DS(on) D Conduction 65 m 4.5 V 3.8 A NChannel Footprint Same as SC88 Package 2.0 A 85 m 2.5 V 20 V Leading Edge Trench Technology for Low On Resistance 120 m 1.8 V 1.7 A 1.8 V Gate Threshold Voltage 100 m 4.5 V 4.1 A Low Profile (< 0.8 mm) for Easy Fit in Thin Environments PChannel 2.0 A 135 m 2.5 V 20 V This is a PbFree Device 200 m 1.8 V 1.6 A Applications Synchronous DCDC Conversion Circuits Load/Power Management of Portable Devices like PDAs, Cellular MARKING D2 D1 DIAGRAM Phones and Hard Drives Color Display and Camera Flash Regulators 1 WDFN6 JM M CASE 506AN MAXIMUM RATINGS (T = 25C unless otherwise noted) J Pin 1 Parameter Symbol Value Unit JM = Specific Device Code DraintoSource Voltage NCh V 20 V DSS M = Date Code PCh 20 = PbFree Package GatetoSource Voltage NCh V 8.0 V GS (Note: Microdot may be in either location) PCh NChannel T = 25C I 3.8 A Steady A D PIN CONNECTIONS Continuous Drain State T = 85C 2.8 A Current (Note 1) t 5 s T = 25C 4.6 A D1 T = 25C 3.3 PChannel I A S1 D1 Steady A D 1 6 Continuous Drain State T = 85C 2.4 A Current (Note 1) t 5 s T = 25C 4.1 A G1 G2 2 5 Power Dissipation Steady P 1.5 W D D2 (Note 1) State T = 25C A D2 3 4 t 5 s 2.3 S2 NChannel T = 25C I 2.6 A A D Steady Continuous Drain State T = 85C 1.9 (Top View) A Current (Note 2) T = 25C 2.3 PChannel I A A D Steady Continuous Drain ORDERING INFORMATION State T = 85C 1.6 A Current (Note 2) Device Package Shipping Power Dissipation Steady P 0.71 W D T = 25C A (Note 2) State NTLJD3119CTAG WDFN6 3000/Tape & Reel Pulsed Drain Current NCh I 18 A t = 10 s (PbFree) p DM PCh 20 NTLJD3119CTBG WDFN6 3000/Tape & Reel Operating Junction and Storage Temperature T , T 55 to C J STG (PbFree) 150 For information on tape and reel specifications, Lead Temperature for Soldering Purposes T 260 C L including part orientation and tape sizes, please (1/8 from case for 10 s) refer to our Tape and Reel Packaging Specification Stresses exceeding those listed in the Maximum Ratings table may damage the Brochure, BRD8011/D. device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: May, 2019 Rev. 5 NTLJD3119C/DNTLJD3119C 1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq 2 oz including traces). 2. Surface Mounted on FR4 Board using the minimum recommended pad size 2 of 30 mm , 2 oz Cu. www.onsemi.com 2