X-On Electronics has gained recognition as a prominent supplier of NTMFS4941NT1G MOSFETs across the USA, India, Europe, Australia, and various other global locations. NTMFS4941NT1G MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

NTMFS4941NT1G ON Semiconductor

NTMFS4941NT1G electronic component of ON Semiconductor
NTMFS4941NT1G ON Semiconductor
NTMFS4941NT1G MOSFETs
NTMFS4941NT1G  Semiconductors

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See Product Specifications
Part No. NTMFS4941NT1G
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: MOSFET NFET SO8FL 30V
Datasheet: NTMFS4941NT1G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1146: USD 0.4256 ea
Line Total: USD 487.74 
Availability - 10185
Ship by Thu. 16 Jan to Wed. 22 Jan
MOQ: 1146  Multiples: 1
Pack Size: 1
Availability Price Quantity
17460
Ship by Thu. 16 Jan to Wed. 22 Jan
MOQ : 1146
Multiples : 1
1146 : USD 0.4256

170031
Ship by Thu. 16 Jan to Wed. 22 Jan
MOQ : 1146
Multiples : 1
1146 : USD 0.4256

54103
Ship by Thu. 16 Jan to Wed. 22 Jan
MOQ : 1146
Multiples : 1
1146 : USD 0.4256

10185
Ship by Thu. 16 Jan to Wed. 22 Jan
MOQ : 1146
Multiples : 1
1146 : USD 0.4256

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Configuration
Series
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Factory Pack Quantity :
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the NTMFS4941NT1G from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NTMFS4941NT1G and other electronic components in the MOSFETs category and beyond.

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NTMFS4941N MOSFET Power, Single, N-Channel, SO-8 FL 30 V, 47 A Features NTMFS4941N MAXIMUM RATINGS (T = 25C unless otherwise stated) J Parameter Symbol Value Unit Single Pulse DraintoSource Avalanche E 42 mJ AS Energy T = 25C, V = 50 V, V = 10 V, J DD GS I = 29 A , L = 0.1 mH, R = 25 L pk G Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 4.9 JC JunctiontoAmbient Steady State (Note 3) R 48.8 JA C/W JunctiontoAmbient Steady State (Note 4) R 137 JA JunctiontoAmbient (t 10 s) (Note 3) 17.5 R JA 3. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 4. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V VGS = 0 V, I = 12 A, 34 V (BR)DSSt D(aval) (transient) T = 25C, t = 100 ns case transient DraintoSource Breakdown Voltage V / 15 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 1.0 DSS GS J A V = 24 V DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V V = V , I = 250 A 1.2 1.67 2.2 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 4.0 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 30 A 4.7 6.2 DS(on) GS D I = 15 A 4.7 D m V = 4.5 V I = 30 A 7.1 9.0 GS D I = 15 A 7.1 D Forward Transconductance g V = 1.5 V, I = 15 A 32 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 1650 ISS Output Capacitance C 570 V = 0 V, f = 1 MHz, V = 15 V pF OSS GS DS Reverse Transfer Capacitance C 17 RSS Capacitance Ratio C / V = 0 V, V = 15 V, f = 1 MHz 0.010 0.021 RSS GS DS C ISS 5. Pulse Test: pulse width 300 s, duty cycle 2%. 6. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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