ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. ESD7L, SESD7L ESD Protection Diode UltraLow Capacitance The ESD7L Series is designed to protect voltage sensitive components from damage due to ESD in applications that require ultra low capacitance to preserve signal integrity. Excellent clamping www.onsemi.com capability, low leakage and fast response time are combined with an ultra low diode capacitance of 0.5 pF to provide best in class protection from IC damage due to ESD. The ultra small SOT723 1 package is ideal for designs where board space is at a premium. The PIN 1. CATHODE 3 2. CATHODE ESD7L Series can be used to protect two unidirectional lines or one 3. ANODE 2 bidirectional line. When used to protect one bidirectional line, the effective capacitance is 0.25 pF. Because of its low capacitance, it is well suited for protecting high frequency signal lines such as USB2.0 high speed and antenna line applications. Specification Features: SCALE 4:1 Low Capacitance 0.5 pF Typical Low Clamping Voltage SOT723 CASE 631AA Small Body Outline Dimensions: 0.047 x 0.047 (1.20 mm x 1.20 mm) Low Body Height: 0.020 (0.5 mm) Standoff Voltage: 5 V MARKING DIAGRAM Low Leakage Response Time is Typically < 1.0 ns IEC6100042 Level 4 ESD Protection L6 M S Prefix for Automotive and Other Applications Requiring Unique 1 Site and Control Change Requirements AECQ101 Qualified and PPAP Capable L6 = Specific Device Code M = Date Code This is a PbFree Device Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V0 ORDERING INFORMATION LEAD FINISH: 100% Matte Sn (Tin) Device Package Shipping MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260C ESD7L5.0DT5G SOT723 8000/Tape & Reel (PbFree) Device Meets MSL 1 Requirements MAXIMUM RATINGS SESD7L5.0DT5G SOT723 8000/Tape & Reel (PbFree) Rating Symbol Value Unit For information on tape and reel specifications, IEC 6100042 (ESD) Contact 10 kV including part orientation and tape sizes, please Total Power Dissipation on FR5 Board P 150 mW D refer to our Tape and Reel Packaging Specifications (Note 1) T = 25C A Brochure, BRD8011/D. Storage Temperature Range T 55 to +150 C stg Junction Temperature Range T 55 to +150 C J DEVICE MARKING INFORMATION Lead Solder Temperature Maximum T 260 C L See specific marking information in the device marking (10 Second Duration) column of the Electrical Characteristics tables starting on page 2 of this data sheet. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: November, 2017 Rev. 7 ESD7L/D