1.6 x 1.6 x 0.65mm Red & Blue SMD 1.6 x 1.6 x 0.65mm Red & Blue SMD OSRB0603C1C Features Outline Dimension Bi-Color Super high brightness of surface mount LED Water Clear Flat Mold Compact package outline (LxWxT) of 1.6mm x 1.6mm x 0.65mm Compatible to IR reflow soldering. Red Applications Backlighting (switches, keys, etc.) Blue Marker lights (e.g. steps, exit ways, etc.) N o t es : 1 . A l l d i me n si o n s are i n m il l im et ers 2 . T o l er an ce i s 0 .1 0 m m u n l es s o th e rw i se n o te d. Absolute Maximum Rating ((TTaa==2255)) ((TTaa==2255)) Directivity Symbo Value 0 Item Unit l Red Blue DC Forward Current I 30 20 mA F Pulse Forward Current* I 100 100 mA FP Reverse Voltage V V 5 5 R 0 Power Dissipation mW P 78 72 D Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol 260/5sec - *Pulse width Max 0.1ms, Duty ratio max 1/10 Electrical -Optical Characteristics ((((TTTTaaaa====22225555)))) 21/2(deg) V (V) I (A) Iv(mcd) D(nm) F R Min. Typ. Max. Max. Min. Typ. Max. Min. Typ. Max. Typ. Part Number Color I =20mA V =5V I =20mA F R F Red HR 1.8 2.1 2.6 10 - 120 - 620 630 640 120 OSRB0603C1C Blue BL 2.9 3.1 3.6 10 - 80 - 460 465 475 120 Note: * Vf tolerance: 0.05V * Dominant wavelength tolerance: 1nm * Luminous intensity is NIST reading. Luminous intensity tolerance:10% LED & Application Technologies 1.6 x 1.6 x 0.65mm Red & Blue SMD 1.6 x 1.6 x 0.65mm Red & Blue SMD OSRB0603C1C Recommended Soldering Temperature Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies