HI-506, HI-507, HI-508, HI-509 Data Sheet October 30, 2007 FN3142.8 Single 16 and 8/Differential 8-Channel and Features 4-Channel CMOS Analog Multiplexers Pb-Free Available (RoHS Compliant) (See Ordering Info) The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS Low ON Resistance 180 multiplexers each include an array of sixteen and eight Wide Analog Signal Range . 15V analog switches respectively, a digital decoder circuit for channel selection, voltage reference for logic thresholds, and TTL/CMOS Compatible an enable input for device selection when several Access Time . 250ns multiplexers are present. The Dielectric Isolation (DI) process used in fabrication of these devices eliminates the Maximum Power Supply 44V problem of latchup. DI also offers much lower substrate Break-Before-Make Switching leakage and parasitic capacitance than conventional junction isolated CMOS (see Application Note AN520). No Latch-Up Replaces DG506A/DG506AA and DG507A/DG507AA The switching threshold for each digital input is established by an internal +5V reference, providing a guaranteed minimum Replaces DG508A/DG508AA and DG509A/DG509AA 2.4V for logic 1 and maximum 0.8V for logic 0. This allows Pb-Free Available (RoHS Compliant) direct interface without pullup resistors to signals from most logic families: CMOS, TTL, DTL and some PMOS. For Applications protection against transient overvoltage, the digital inputs include a series 200 resistor and diode clamp to each Data Acquisition Systems supply. Precision Instrumentation The HI-506 is a single 16-channel, the HI-507 is an Demultiplexing 8-channel differential, the HI-508 is a single 8-channel and Selector Switch the HI-509 is a 4-channel differential multiplexer. If input overvoltages are present, the HI-546/HI-547/HI-548/ HI-549 multiplexers are recommended. CAUTION: These devices are sensitive to electrostatic discharge follow proper IC Handling Procedures. 1 1-888-INTERSIL or 1-888-468-3774 Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2003, 2005, 2007. All Rights Reserved All other trademarks mentioned are the property of their respective owners.HI-506, HI-507, HI-508, HI-509 Ordering Information TEMP. PART NUMBER PART MARKING RANGE (C) PACKAGE PKG. DWG. HI1-0506-2 HI1-506-2 -55 to +125 28 Ld CERDIP F28.6 HI1-0506-5 HI1-506-5 0 to +75 28 Ld CERDIP F28.6 HI4P0506-5 HI4P 506-5 0 to +75 28 Ld PLCC N28.45 HI4P0506-5Z (Note 1) HI4P 506-5Z 0 to +75 28 Ld PLCC (Pb-free) N28.45 HI9P0506-5 HI9P506-5 0 to +75 28 Ld SOIC M28.3 HI9P0506-9 HI9P506-9 -40 to +85 28 Ld SOIC M28.3 HI9P0506-9Z (Note 1) HI9P506-9Z -40 to +85 28 Ld SOIC (Pb-free) M28.3 HI1-0507-2 HI1-507-2 -55 to +125 28 Ld CERDIP F28.6 HI3-0507-5 HI3-507-5 0 to +75 28 Ld PDIP E28.6 HI3-0507-5Z HI3-507-5Z 0 to +75 28 Ld PDIP (Note 3) (Pb-free) E28.6 HI1-0508-2 HI1-508-2 -55 to 125 16 Ld CERDIP F16.3 HI1-0508-5 HI1-508 0 to +75 16 Ld CERDIP F16.3 HI3-0508-5 HI3-508-5 0 to +75 16 Ld PDIP E16.3 HI3-0508-5Z (Note 1) HI3-508-5Z 0 to +75 16 Ld PDIP (Note 3) (Pb-free) E16.3 HI9P0508-5 HI9P508-5 0 to +75 16 Ld SOIC M16.15 HI9P0508-5Z (Notes 1, 2) HI9P508-5Z 0 to +75 16 Ld SOIC (Pb-free) M16.15 HI9P0508-9 HI9P508-9 -40 to +85 16 Ld SOIC M16.15 HI9P0508-9Z (Note 1) HI9P508-9Z -40 to +85 16 Ld SOIC (Pb-free) M16.15 HI1-0509-2 HI1-509-2 -55 to +125 16 Ld CERDIP F16.3 HI1-0509-4 HI1-509-4 -25 to +85 16 Ld CERDIP F16.3 HI1-0509-5 HI1-509-5 0 to +75 16 Ld CERDIP F16.3 HI3-0509-5 HI3-509-5 0 to +75 16 Ld PDIP E16.3 HI4P0509-5 HI4P 509-5 0 to +75 20 Ld PLCC N20.35 HI4P0509-5Z (Notes 1, 2) HI4P 509-5Z 0 to +75 20 Ld PLCC (Pb-free) N20.35 HI9P0509-5 HI9P 509-5 0 to +75 16 Ld SOIC M16.15 HI9P0509-5Z (Notes 1, 2) HI9P 509-5Z 0 to +75 16 Ld SOIC (Pb-free) M16.15 NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Add 96 suffix for tape and reel. Please refer to TB347 for details on reel specifications. 3. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. FN3142.8 2 October 30, 2007