Versatile, High Resolution 18-Bit ZSSC3018 Sensor Signal Conditioner Datasheet Benefits Brief Description Integrated 26-bit calibration math DSP The ZSSC3018 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital Fully corrected signal at digital output conversion of differential or pseudo-differential input signals. Layout customized for die-die bonding with sensor for high- Designed for high-resolution sensor module applications, the density chip-on-board assembly st nd ZSSC3018 can perform offset, span, and 1 and 2 order One-pass calibration minimizes calibration costs temperature compensation of the measured signal. Developed for No external trimming, filter, or buffering components required correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an Highly integrated CMOS design internal sensor. Integrated reprogrammable non-volatile memory The measured and corrected sensor values are provided at the Excellent for low-voltage and low-power battery applications 2 digital output pins, which can be configured as I C ( 3.4MHz) or Optimized for operation in calibrated resistive sensor SPI ( 10MHz). Digital compensation of signal offset, sensitivity, (e.g., pressure) or calibrated absolute voltage sensor temperature, and non-linearity is accomplished via a 26-bit (e.g., thermopile) modules internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3018 is simple via the serial interface. The Physical Characteristics interface is used for the PC-controlled calibration procedure, Supply voltage range: 1.68V to 3.6V which programs the set of calibration coefficients in memory. The Current consumption: ~1.0mA (typical) in operating mode ZSSC3018 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high- Sleep Mode current: 50nA (typical) at 125C 20nA (typical) speed control, safety, and real-time sensing applications with the at 85C highest requirements for energy efficiency. Temperature resolution: <0.003K/LSB Best-in-class energy-efficiency: with 16-bit resolution: <140pJ/step with 18-bit resolution: <50pJ/step Features Operation temperature: 40C to +125C Flexible, programmable analog front-end design up to 18-bit Delivery options: die or 24-PQFN (4 x 4 mm) package analog-to-digital converter (ADC) Fully programmable gain amplifier with gain range from 6.6 to * FSO = Full Scale Output. 216 (linear) Internal auto-compensated temperature sensor st nd Digital compensation of individual sensor offset 1 and 2 st ZSSC3018 Application Example order digital compensation of sensor gain as well as of 1 nd and 2 order temperature gain and offset drift VDD Programmable interrupt operation Sensor Bridge High-speed sensing: e.g., 16-bit conditioned sensor signal GND -1 measurement rate >500s EOC ZSSC3018 Typical sensor system can achieve an accuracy of better than MISO 0.10% FSO* -40 to 125C MOSI/SDA SCLK/SCL 24-PQFN SS 2017 Integrated Device Technology, Inc 1 January 10, 2017 ZSSC3018 Datasheet Block Diagram Vreg int VDDB (Bridge Sensor Example) VDD VTP Temperature AGND / CM Bias Current Reference Voltage Regulator Generator Generator Sensor V TN Power Ctr. VSS ZSSC3018 DSP Core A MUX PGA ADC EOC (Calculations, INP D Communication) 18 bit 18 Bit INN Sensor Pre-Amplifier Bridge SCLK/SCL SS SPI MOSI/SDA VSSB MISO System Clock Generator MTP Power-ON IC RES Control Unit Reset Oscillator Analog Digital Interface Functionality Support Applications Barometric altitude measurement for portable Fan control navigation or emergency call systems Industrial, pneumatic, and liquid pressure Altitude measurement for car navigation High-resolution temperature measurements Weather forecast Object-temperature radiation (via thermopile) Ordering Information Product Sales Code Description Package ZSSC3018BA3W ZSSC3018 24-PQFN temperature range: 40C to +125C 7 Reel ZSSC3018BA2B ZSSC3018 Die temperature range: 40C to +125C Unsawn on Wafer (725m) ZSSC3018BA2C ZSSC3018 Die temperature range: 40C to +125C Sawn on Wafer Frame ZSSC3018BA2D ZSSC3018 Die temperature range: 40C to +125C Sawn in Waffle Pack (for sampling only) ZSSC3018KITV1P0 Modular ZSSC3018 SSC Evaluation Kit including three interconnecting boards, five ZSSC3018 24-PQFN samples, and cable. Software is available for download on www.IDT.com/ZSSC3018. Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road 1-800-345-7015 or 408-284-8200 www.IDT.com/go/support San Jose, CA 95138 Fax: 408-284-2775 www.IDT.com www.IDT.com/go/sales DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guarante ed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but no t limited to, the suitability of IDT s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any licens e under intellectual property rights of IDT or any third parties. IDT s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT p roduct can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a mann er does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated Device Technology, Inc. All rights reserved. 2017 Integrated Device Technology, Inc 2 January 10, 2017 Multiplexer