EClamp2388K ESD/EMI Protection for Color LCD Interfaces TM PROTECTION PRODUCTS - EMIClampPROTECTION PRODUCTS PRELIMINARY Features Description TM The EClamp 2388K is a low pass filter array with Bidirectional EMI/RFI filter with integrated TVS integrated TVS diodes. It is designed to suppress un- for ESD protection wanted EMI/RFI signals and provide electrostatic dis- ESD protection to IEC 61000-4-2 (ESD) Level 4, charge (ESD) protection in portable electronic equip- 15kV (air), 8kV (contact) ment. This state-of-the-art device utilizes solid-state Filter performance: 30dB minimum attenuation silicon-avalanche technology for superior clamping 800MHz to 2.7GHz performance and DC electrical characteristics. It has TVS working voltage: 5V protection of color LCD panelsprotection of color LCD panelsprotection of color LCD panels been optimized for protection of color LCD panelsprotection of color LCD panels Resistor: 200 +/ 15% in cellular phones and other portable electronics. Typical Capacitance: 12pF (VR = 2.5V) Protection and filtering for eight lines The device consists of eight identical circuits comprised of TVS diodes for ESD protection, and a resistor - Solid-state technology capacitor network for EMI/RFI filtering. A series Mechanical Characteristics resistor value of 200 and a capacitance value of 12pF are used to achieve 30dB minimum attenuation from SLP3313P16 16-pin package 800MHz to 2.7GHz. The TVS diodes provide effective RoHS/WEEE Compliant suppression of ESD voltages in excess of 15kV (air Nominal Dimensions: 3.3 x 1.3 x 0.50 mm discharge) and 8kV (contact discharge) per IEC 61000- Lead Pitch: 0.4mm 4-2, level 4. Lead finish: NiPdAu Marking: Marking Code The EClamp2388K is in a 16-pin, RoHS/WEEE compli- Packaging: Tape and Reel per EIA 481 ant, SLP3313P16 package. It measures 3.3 x 1.3 x 0.50mm. The leads are spaced at a pitch of 0.4mm Applications and are finished with lead-free NiPdAu. The small Color LCD Protection package makes it ideal for use in portable electronics Cell Phone CCD Camera Lines such as cell phones, digital still cameras, and PDAs. CDMA/GSM Cell Phones Circuit Diagram (Each Line) Package Configuration 3.30 1 2 200 IN OUT 1.30 12pF 12pF 0.40 BSC GND 0.50 Device Schematic (8X) 16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm www.semtech.com Revision 05/23/2007 1EClamp2388K PROTECTION PRODUCTS PRELIMINARY Maximum Ratings Rlating Seymbo Vsalu Unit ESD per IEC 61000-4-2 (Air) +/- 17 V kV ESD ESD per IEC 61000-4-2 (Contact) +/- 12 o JTunction Temperature 125 C J o OTperating Temperature -40 to +85 C op o STtorage Temperature -55 to +150 C STG o Electrical Characteristics (T = 25 C) PPrPPrPlaaaaarrrrraaaaammmmmeeeeettttteeeeerrr SSSlSlSsyyyyymmmmmbbbbboooooll CsCCCmCsooooonnnnndddddiiiiitttttiiiiiooooonnnnnss MmMMMlMmiiiiinnnnniiiiimmmmmuuuuumm TlTTTmTlyyyyypppppiiiiicccccaaaaall MmMMMsMmaaaaaxxxxxiiiiimmmmmuuuuumm UsUUUUsnnnnniiiiitttttss TVVS Reverse Stand-Off Voltage 5V RWM TVVS Reverse Breakdown Voltage I=61mA 8 1V0 BR t TIVS Reverse Leakage Current V=53.0V 0A. R RWM TRotal Series Resistance E0ach Line 107 200 2s3 Ohm CCapacitance C Each Line 120 151Fp 1, 2 V = 2.5V, f = 1MHz R TCotal Capacitance Input to Gnd, 240 203Fp in Each Line V = 2.5V, f = 1MHz R www.semtech.com 2007 Semtech Corp. 2