EClamp2388P ESD/EMI Protection for Color LCD Interfaces TM PROTECTION PRODUCTS - EMIClampPROTECTION PRODUCTS PRELIMINARY Features Description TM The EClamp 2388P is a low pass filter array with Bidirectional EMI/RFI filter with integrated TVS integrated TVS diodes. It is designed to suppress for ESD protection unwanted EMI/RFI signals and provide electrostatic ESD protection to IEC 61000-4-2 (ESD) Level 4, discharge (ESD) protection in portable electronic 15kV (air), 8kV (contact) equipment. This state-of-the-art device utilizes solid- Filter performance: 30dB minimum attenuation state silicon-avalanche technology for superior clamp- 800MHz to 2.7GHz ing performance and DC electrical characteristics. TVS working voltage: 5V protection of colorprotection of colorprotection of color They have been optimized for protection of colorprotection of color Resistor: 200 +/ 15% LCD panelsLCD panelsLCD LCD panelsLCD panelspanels in cellular phones and other portable Typical Capacitance: 12pF (VR = 2.5V) electronics. Protection and filtering for eight lines The device consists of eight identical circuits comprised Solid-state technology of TVS diodes for ESD protection, and a resistor - Mechanical Characteristics capacitor network for EMI/RFI filtering. A series resistor value of 200 and a capacitance value of 12pF SLP4016P16 16-pin package are used to achieve 30dB minimum attenuation from RoHS/WEEE Compliant 800MHz to 2.7GHz. The TVS diodes provide effective Nominal Dimensions: 4.0 x 1.6 x 0.58 mm suppression of ESD voltages in excess of 15kV (air Lead Pitch: 0.5mm discharge) and 8kV (contact discharge) per IEC 61000- Lead finish: NiPd 4-2, level 4. Marking: Marking Code Packaging: Tape and Reel per EIA 481 The EClamp2388P is in a 16-pin, RoHS/WEEE compli- ant, SLP4016P16 package. It measures 4.0 x 1.6 x Applications 0.58mm. The leads are spaced at a pitch of 0.5mm Color LCD Protection and are finished with lead-free NiPd. The small pack- Cell Phone CCD Camera Lines age makes it ideal for use in portable electronics such CDMA/GSM Cell Phones as cell phones, digital still cameras, and PDAs. Circuit Diagram (Each Line) Package Configuration 4.00 1 2 200 IN OUT 1.60 12pF 12pF 0.50 BSC GND 0.58 Device Schematic (8X) 16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm www.semtech.com Revision 1/25/2006 1EClamp2388P PROTECTION PRODUCTS PRELIMINARY Maximum Ratings Rlating Seymbo Vsalu Unit ESD per IEC 61000-4-2 (Air) +/- 17 V kV ESD ESD per IEC 61000-4-2 (Contact) +/- 12 o JTunction Temperature 125 C J o OTperating Temperature -40 to +85 C op o STtorage Temperature -55 to +150 C STG o Electrical Characteristics (T = 25 C) PrPPPrPlaaaaarrrrraaaaammmmmeeeeettttteeeeerrr SSlSSlSsyyyyymmmmmbbbbboooooll CsCCCmCsooooonnnnndddddiiiiitttttiiiiiooooonnnnnss MmMMMlMmiiiiinnnnniiiiimmmmmuuuuumm TlTTTmTlyyyyypppppiiiiicccccaaaaall MmMMMsMmaaaaaxxxxxiiiiimmmmmuuuuumm UsUUUUsnnnnniiiiitttttss TVVS Reverse Stand-Off Voltage 5V RWM TVVS Reverse Breakdown Voltage I=61mA 8 1V0 BR t TIVS Reverse Leakage Current V=53.0V 0A. R RWM TRotal Series Resistance E0ach Line 107 200 2s3 Ohm CCapacitance Input to Gnd, 120 151Fp in Each Line V = 2.5V, f = 1MHz R CCapacitance Input to Gnd, 128 272Fp in Each Line V = 0V, f = 1MHz R www.semtech.com 2006 Semtech Corp. 2