EClamp2398P ESD/EMI Protection for Color LCD Interfaces PROTECTION PRODUCTS PRELIMINARY PROTECTION PRODUCTS - EMIClamp Features Description EClamp 2398P is a low pass (L-C) filter array with Bidirectional EMI/RFI filter with integrated TVS integrated TVS diodes. It is designed to suppress for ESD protection unwanted EMI/RFI signals and provide electrostatic ESD protection to IEC 61000-4-2 (ESD) Level 4, discharge (ESD) protection in portable electronic 20kV (air), 5kV (contact) equipment. This state-of-the-art device utilizes solid- Filter performance: 30dB minimum attenuation state silicon-avalanche technology for superior clamp- 800MHz to 2.7GHz ing performance and DC electrical characteristics. TVS working voltage: 5V They have been optimized for protection of colorprotection of colorprotection of colorprotection of colorprotection of color Inductor: 19nH (Typical) LCD and camera linesLCD LCD and camera linesand camera lines in cellular phones and other LCD and camera linesLCD and camera lines Capacitance: 12pF (Typical at VR = 2.5V) portable electronics. Protection and filtering for eight lines Solid-state technology EClamp2398P device consists of eight identical circuits comprised of TVS diodes for ESD protection, and a 5- Mechanical Characteristics pole inductor - capacitor network for EMI/RFI filtering. SLP4016P16 16-pin package A typical inductor value of 19nH and a capacitor value Pb-Free, Halogen Free, RoHS/WEEE Compliant of 12pF are used to achieve 30dB minimum attenua- Nominal Dimensions: 4.0 x 1.6 x 0.58 mm tion from 800MHz to 2.7GHz. The TVS diodes provide Lead Pitch: 0.5mm effective suppression of ESD voltages in excess of Lead finish: NiPd 15kV (air discharge) and 8kV (contact discharge) per Marking: Marking Code IEC 61000-4-2, level 4. Packaging: Tape and Reel EClamp2398P is in a 16-pin SLP4016P16 package Applications measuring 4.0 x 1.6 x 0.58mm. Leads are spaced at a Color LCD Protection pitch of 0.5mm and are finished with lead-free NiPd. Cell Phone CCD Camera Lines The small package makes it ideal for use in portable Clamshell Cell Phones electronics such as cell phones, digital still cameras, and PDAs. Circuit Diagram (Each Line) Package Configuration 4.00 1 2 L1 L2 IN 1.60 OUT C1 C2 C3 0.50 BSC GND 0.58 Device Schematic (8X) 16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm www.semtech.com Revision 02/20/2014 1EClamp2398P PROTECTION PRODUCTS PRELIMINARY Absolute Maximum Rating Rlating Seymbo Vsalu Unit 1 ESD per IEC 61000-4-2 (Air) +/- 20 V kV 1 ESD ESD per IEC 61000-4-2 (Contact) +/- 15 o JTunction Temperature 125 C J o OTperating Temperature -40 to +85 C op o STtorage Temperature -55 to +150 C STG Notes 1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. o Electrical Characteristics (T=25 C) Plarameter SsymboCmondition MlinimuTmypicaMsaximu Unit RVeverse Stand-Off VoltageA5ny I/O to GND V RWM RVeverse Breakdown Voltage I = 1mA, 68 1V0 BR t Any I/O to GND RIeverse Leakage Current V = 5.0V, 0A.100 R RWM Any I/O to GND DRC Resistance Each Channel, Between 1s8 Ohm DC Input and Output Ffilter Cut-Off Frequency Z = Z=050 Ohms 1z5 MH c Source Load ILnductance 1H9 n TLotal Series Inductance + L Each Channel, Between 3H8 n 1 2 Input and Output CCapacitance , C , C V=02.5V, f = 1MHz 12151Fp 1 2 3 R TCotal Capacitance + C V = 2.5V, f = 1MHz, 360 354Fp 1 2 + R C Each Channel Input to 3 GND www.semtech.com 2014 Semtech Corporation 2