EMIF02-MIC06F3 2-line IPAD EMI filter and ESD protection Datasheet - production data Description The EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering. The EMIF02-MIC06F3 Flip-Chip packaging means the package size is equal to the die size. That s why EMIF02-MIC06F3 is a very small device. Lead -free Flip-chip package (8 bumps) Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV. Features Figure 1. Pin configuration (bump side) 2-line symmetrical low-pass filter Lead-free package 3 2 1 2 Very low PCB space consuming: < 1.5 mm MIC ECI Bias Very thin package: 0.65 mm A High efficiency in ESD suppression IEC 61000-4-2 level 4 n Op Mic2p Gnd B High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging A Mic2n On C Gnd Complies with the following standards B2 and C2 GND bumps must be conneted together on the PCB IEC 61000-4-2 level 4: 15 kV (air discharge) 8 kV (contact discharge) Application Mobile phones (differential microphone filtering and ESD protection) TM: IPAD is a trademark of STMicroelectronics. May 2014 DocID15195 Rev 5 1/8 This is information on a product in full production. www.st.com Obsolete Product(s) - Obsolete Product(s)Characteristics EMIF02-MIC06F3 1 Characteristics Figure 2. Configuration ECI GND A2 GND GND Mic Bias A3 C11 C21 R11 B1 R31 R21 B3 Mic2p to ASIC Mic2n R22 C1 C3 R12 C22 C12 GND GND GND GND B2 and C2 are ground pins ECI pin connection The ECI pin (enhancement control interface) is an input pin for the audio pre-amplifier chip which detects the voltage of the microphone line MIC2P in case the user presses the on- hook/off-hook button on the headset. When the user selects off-hook using the headset button, the MIC2P is shorted to MIC2N which is grounded. If your design does not support the ECI feature, the ECI pin must be left open (not connected). Table 1. Absolute ratings (limiting values) Symbol Parameter and test conditions Value Unit Pins B1 and C1: ESD discharge IEC 61000-4-2, level 4 air discharge 15 contact discharge 8 V kV PP Pins A2, A3, B2, B3, C2, C3: ESD discharge IEC 61000-4-2, level 1 air discharge 2 contact discharge 2 P Power dissipation at T = 25 C 60 mW D amb T Maximum junction temperature 125 C j T Operating temperature range - 40 to + 85 C op T Storage temperature range - 55 to + 150 C stg 2/8 DocID15195 Rev 5 Obsolete Product(s) - Obsolete Product(s)