TECHNICAL DATA SHEET STANNOL SOLDER WIRES OF THE KRISTALL-SERIES No-Clean solder wires with clear residues DESCRIPTION Stannol Kristall solder wires have been specially formulated to complement No Clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Stannol Kristall solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of Stannol Kristall fluxes means they are also well suited to soldering applications requiring high melting temperature alloys. The resin and flux systems are designed to leave relatively low residues and to minimise residual activity. This is achieved by ensuring some decomposition and volatilisation takes place during the soldering process. In some situations, this may generate visible fuming but in all cases, rosin fumes must be removed from the breathing zone of operators. CHARACTERISTICS Stannol Kristall 400 is designed for users who require a halide free formulation. Stannol Kristall 502, 505 and 511 contain different halide levels with maximised soldering power Stannol Kristall 400, 502, 505 and 511 cored wires are manufactured with a range of flux contents. Although users will normally be using products with a nominal flux content of 3%, the superior performance of the Kristall products may allow a lower flux content to be specified e.g. 2.2%. This will further improve residue appearance by reducing the quantity. All are available in alloys conforming to national and international standards, including lead free alloys. Som e alloys and flux contents may be manufactured to special order. Stannol Kristall solid fluxes are based on modified rosins and carefully selected activators. In use they exhibit a mild rosin odour and leave a small quantity of clear residue. The used activated resin shows the following advantages: halide free version (Kristall 400) fast soldering (wide range of activities to suit all applications) good spread (on copper, brass and nickel) clear residues heat stable (low spitting) mild odour STANNOL GmbH TDB LD Kristall-Serie EN Issue: 30.10.14 1 Oskarstrae 3-7 42283 Wuppertal Tel: +49 (0)202-585-0 Fax: +49 (0)202-585-111 E-Mail: info stannol.de www.stannol.de APPLICATION Soldering Iron: Good results should be obtained using a range of tip temperatures. However, the optimum tip temperature and heat capacity required for a hand soldering process is a function of both soldering iron design and the nature of the tas k and care should be exercised to avoid unnecessarily high tip temperatures for excessive times. A high tip temperature will increase any tendency to flux spitting and it may produce some residue darkening. The soldering iron tip should be properly tinned and this may be achieved using Stannol Kristall cored wire. Severely contaminated soldering iron tips should first be cleaned and pre-tinned using Stannol Tippy, then wiped on a clean, damp sponge before re-tinning with Kristall cored wire. Soldering process: Stannol Kristall flux cored wires contain a careful balance of resins and activators to provide clear residues, maximum activity and high residue reliability, without cleaning in most situations. To achieve the best results from Stannol Kristall solder wires, recommended working practices for hand soldering should be observed as follows: a) Apply the soldering iron tip to the work surface, ensuring that it simultaneously contacts the base material and the component termination to heat both surfaces adequately. This process should only take a fraction of a second. b) Apply Kristall flux cored solder wire to a part of the joint surface away from the soldering iron and allow to flow sufficiently to form a sound joint fillet - this should be virtually instantaneous. Do not apply excessive solder or heat to the joint as this may result in dull, gritty fillets and excessive or darkened flux residues. c) Remove solder wire from the workpiece and then remove the iron tip. d) The total process will be very rapid, depending upon thermal mass, tip temperature and configuration and the solderability of the surfaces to be joined. Cleaning: Stannol Kristall flux cored solder wires have been formulated to leave pale flux residues and to resist spitting and fuming. In most industrial and consumer electronics applications cleaning will not be required and the product may therefore be used to complement a No Clean wave soldering or reflow process or to allow repairs to cleaned boards without the need for a second cleaning process. Should residue quantity be an important consideration, Stannol X39B flux cored wire may be specified if a halide free product is required. Stannol Kristall 502, 505 and 511 offer good activity and consequently cored wire flux contents and hence residue levels may be reduced in comparison with equivalent conventional products. Should cleaning be required, this is best achieved using Stannol Flux-Ex 200B or Stannol Flux-Ex 500 solvent cleaner. Other proprietary solvent or semi-aqueous processes may be suitable but saponification is not recommended. TEST RESULTS GENERAL TESTS KRISTALL 400 KRISTALL 502 KRISTALL 505 KRISTALL 511 J-STD-004 2 - solder spread (mm ) 210 310 315 340 - corrosion test pass pass pass pass SIR Test (without cleaning) - IPC-SF-818 Class3 pass pass pass pass - Bellcore TR-NWT-000078 pass pass pass pass Electromigration-Test (without cleaning) - Bellcore TR-NWT-000078 pass pass pass pass Classification - J-STD-004 RE L0 RE L1 RE M1 RE M1 - IPC-SF-818 LR3CN MR3CN MR3CN MR3CN 2 STANNOL GmbH TDB LD Kristall-Serie EN Issue: 30.10.14 Oskarstrae 3-7 42283 Wuppertal Tel: +49 (0)202-585-0 Fax: +49 (0)202-585-111 E-Mail: info stannol.de www.stannol.de