ASM330LHHTR STMicroelectronics

ASM330LHH Automotive 6-axis inertial module: 3D accelerometer and 3D gyroscope Datasheet - production data Description The ASM330LHH is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with an extended temperature range up to +105 C and designed to address automotive non-safety applications. LGA-14L 3 STs family of MEMS sensor modules leverages the Typ: 2.5 x 3.0 x 0.83 mm robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the Features automotive and consumer market. The ASM330LHH is AEC-Q100 qualified AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive Extended temperature range reliability standards. All the parts are fully tested with from -40 to +105 C respect to temperature to ensure the highest quality Embedded compensation for high stability over level. temperature The sensing elements are manufactured using STs Accelerometer user-selectable full scale up to proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that 16 g allows the design of a dedicated circuit which is Extended gyroscope range from 125 to trimmed to better match the characteristics of the 4000 dps sensing element. SPI & IC host serial interface The ASM330LHH has a full-scale acceleration range of 2/4/8/16 g and a wide angular rate range of Six-channel synchronized output to enhance 125/250/500/1000/2000/4000 dps that enables accuracy of dead-reckoning algorithms its usage in a broad range of automotive applications. Smart programmable interrupts All the design aspects of the ASM330LHH have been Embedded 3 kbytes FIFO available to optimized to reach superior output stability, extremely underload host processor low noise and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and ECOPACK, RoHS and Green compliant sensor fusion. The ASM330LHH is available in a 14-lead plastic land Applications grid array (LGA) package. Dead reckoning (DR) Table 1. Device summary Vehicle-to-everything (V2X) Temp. Telematics, eTolling Part number Package Packing range C Anti-theft systems ASM330LHH -40 to +105 Tray Impact detection and crash reconstruction LGA-14L 3 Tape & (2.5 x 3.0 x 0.83 mm ) ASM330LHHTR -40 to +105 Motion-activated functions Reel Driving comfort Vibration monitoring and compensation May 2020 DocID031239 Rev 4 1/84 This is information on a product in full production. www.st.comContents ASM330LHH Contents 1 Overview . 10 2 Embedded low-power features . 11 3 Pin description 12 4 Module specifications . 14 4.1 Mechanical characteristics 14 4.2 Electrical characteristics 17 4.3 Temperature sensor characteristics . 18 4.4 Communication interface characteristics . 19 4.4.1 SPI - serial peripheral interface . 19 4.4.2 IC - inter-IC control interface 20 4.5 Absolute maximum ratings 21 4.6 Terminology . 22 4.6.1 Sensitivity 22 4.6.2 Zero-g and zero-rate level . 22 5 Digital interfaces . 23 5.1 IC/SPI interface 23 5.1.1 IC serial interface . 23 5.1.2 SPI bus interface 26 6 Functionality 30 6.1 Operating modes . 30 6.2 Gyroscope power modes . 30 6.3 Accelerometer power modes 30 6.4 Block diagram of filters . 31 6.4.1 Block diagram of the gyroscope filter . 31 6.4.2 Block diagrams of the accelerometer filters 32 6.5 FIFO . 33 6.5.1 Bypass mode . 34 6.5.2 FIFO mode . 34 2/84 DocID031239 Rev 4