EMIF06-HSD03F3 STMicroelectronics

EMIF06-HSD03F3 EMI filter with integrated ESD protection for micro-SD Card Datasheet production data Features Very low line capacitance to compensate long PCB tracks (2.5 pF typ.) High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2) Very low PCB space consumption: 1.1 x 2.4 mm Ultralow leakage current: 20 nA max. Very thin package: 0.605 mm Flip-Chip package Smart pinout for easier PCB layout (17 bumps) High reduction of parasitic elements through integration and wafer level packaging Figure 1. Pin configuration (bump side) Lead-free package , 2 Complies with the following standards: 9FF IEC 61000-4-2 level 4:15 kV (air 2 , discharge), 8 kV (contact discharge) *1 , 2 Application *1 , 2 SD3.0, UHS-1 SDR104 (208 MHz) *1 , 2 Description (7 , 2 The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. Figure 2. Functional schematic The EMIF06-HSD03F3 Flip-Chip packaging L = 1 nH R = 1 Ix Ox means the package size is equal to the die size. Thats why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the C = 2.5 pF LINE protected device when subjected to ESD surges up 18 kV. V DET CC October 2016 DocID025248 Rev 4 1/10 This is information on a product in full production. www.st.com 10Application diagram EMIF06-HSD03F3 1 Application diagram Figure 3. Schema Vcc Top layer Second layer DAT2 I1 O1 Vcc DAT3 O2 I2 GND CMD I3 O3 GND V CC I4 O4 GND CLK CPU I5 O5 SD card DET GND contacts face down I6 O6 DAT0 DAT1 SD card contacts spring DET Maximum distance = 50 mm 2/10 DocID025248 Rev 4